Heterogeneous Integration Structure With On-Chip Voltage Regulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Voltage droop occurs during power delivery to memory devices and accelerators in semiconductor devices due to current paths through through-silicon-vias (TSVs) and other wires, leading to reduced power supply efficiency.
Innovation Solution
Incorporation of voltage regulator modules (VRMs) on top of the chip to regulate power delivery to processors and memory devices, compensating for voltage droop by converting input voltage into operating voltages for accelerators and memory chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is delivered through TSVs and wires to memory devices and accelerators, then power supply is achieved, but voltage droop occurs reducing power supply efficiency
Solution Approach 1:
The patent segments the power delivery system by placing individual voltage regulator modules (VRMs) directly on each memory chip and accelerator chip. This segmentation allows each component to have its own dedicated power regulation, eliminating the voltage droop that would otherwise occur through shared TSV and wire paths. Each VRM converts input voltage locally at the component level, ensuring stable power delivery without requiring complex long-distance power transmission infrastructure.
2Reliability
If voltage regulator modules are added to regulate power delivery, then voltage droop is reduced, but device complexity increases
Solution Approach 1:
The patent merges the voltage regulator module directly with each memory chip and accelerator chip in a coupled arrangement. This merging integrates power conversion functionality into the immediate vicinity of each component, ensuring reliable and stable power delivery. By combining the VRM and the active component into a tightly coupled power delivery system, the patent achieves high reliability without requiring complex external power management infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces voltage droop, ensuring stable power delivery to accelerators and memory devices, enhancing overall performance and efficiency of semiconductor devices.
Implementation Method 1
at least one voltage regulator arranged on top of the chip. The at least one voltage regulator can be configured to regulate power being provided from the plurality of TSVs to the processor
Implementation Method 2
a plurality of through-silicon-vias (TSVs). The processor can be configured to communicate with the memory device via a plurality of interconnects
Data Source
AI summary
Heterogeneous integration semiconductor packages with voltage regulation are described. A semiconductor device can include a chip including a memory device and a plurality of through-silicon-vias (TSVs). The semiconductor device can further include a processor arranged on top of the chip. The processor can be configured to communicate with the memory device via a plurality of interconnects. The semiconductor device can further include at least one voltage regulator arranged on top of the chip. The at least one voltage regulator can be configured to regulate power being provided from the plurality of TSVs to the processor.