Heterogeneous Nested Interposer Layout for Warpage-Resistant Die Alignment
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Solution Overview
Problem
Current multi-die packaging architectures face challenges with larger form factors and poor yield and reliability due to alignment issues and warpage when using traditional packaging substrates, particularly with interconnections between dies.
Innovation Solution
The use of heterogeneous nested interposers with cavities and nested components, where dies are connected to the interposer and nested components using interconnects that include bump pads for self-alignment, improving alignment and reliability even with fine-pitched interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional packaging substrates are used for multi-die integration, then dies can be manufactured at different process nodes, but the form factor becomes larger and alignment issues occur
Solution Approach 1:
The patent implements a nested interposer structure where a first interposer is placed within a cavity of a second interposer, creating a hierarchical nested arrangement. This nesting approach allows multiple dies to be integrated in a compact three-dimensional configuration rather than spreading them out in a two-dimensional plane, thereby reducing the overall form factor while maintaining multi-die integration capability
Solution Approach 2:
The patent transitions from traditional two-dimensional planar packaging to three-dimensional vertical stacking by placing interposers within cavities of other interposers. This dimensional change enables compact integration of multiple dies at different process nodes without increasing the lateral footprint, effectively solving the form factor expansion problem
2Adaptability or versatility
If traditional packaging substrates are used for multi-die integration, then dies can be connected, but alignment issues and warpage reduce yield and reliability
Solution Approach 1:
The patent introduces interposers as intermediary structures between dies, which provide standardized connection interfaces and mechanical support. The interposers act as mediators that facilitate precise alignment and connection between dies manufactured at different process nodes, while their cavity structures accommodate nested arrangements, thereby improving both alignment precision and overall reliability
Solution Approach 2:
The patent implements localized cavity structures within interposers at specific positions where nested interposers need to be accommodated. These localized features provide precise mechanical guidance and alignment references, ensuring accurate positioning of nested components without affecting the overall structural integrity, thus improving alignment precision locally where needed
Data Source
AI summary
Embodiments disclosed herein include electronic packages and methods of fabricating electronic packages. In an embodiment, an electronic package comprises an interposer, where a cavity passes through the interposer, and a nested component in the cavity. In an embodiment, the electronic package further comprises a die coupled to the interposer by a first interconnect and coupled to the nested component by a second interconnect. In an embodiment, the first and second interconnects comprise a first bump, a bump pad over the first bump, and a second bump over the bump pad.