Heterogeneous Socket Contacts for High-Speed Signal Integrity
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Solution Overview
Problem
Existing socket designs face challenges in balancing electrical and mechanical requirements, leading to issues such as increased package size, packaging cost, and technical complexity due to uniform pin geometry and manufacturing limitations, which hinder scalability and performance in high-speed data transmission.
Innovation Solution
A heterogeneous socket structure with distinct building blocks, including contact elements and conductive structures made through different processes, allows for independent tuning of electrical and mechanical properties, using conductive coatings or insertable stubs to optimize signal and ground pin configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform pin geometry is used in socket design, then manufacturing is simplified, but electrical performance (insertion loss and crosstalk) deteriorates at high speeds
Solution Approach 1:
The patent applies local quality by transitioning from uniform pin geometry to heterogeneous socket contacts with different geometries optimized for specific functions. Signal pins have different dimensions and configurations compared to ground pins, with each geometry tailored to optimize electrical performance for its specific role in high-speed data transmission
Solution Approach 2:
The patent implements parameter changes by varying multiple geometric parameters of the socket contacts including pin diameter, pin length, spacing, and orientation. These parameter variations enable optimization of electrical characteristics such as impedance control, signal integrity, and crosstalk reduction while maintaining manufacturing feasibility
2Reliability
If socket design is optimized for electrical performance, then insertion loss and crosstalk are reduced, but package size and complexity increase
Solution Approach 1:
The patent applies segmentation by dividing the socket contacts into distinct categories (signal pins and ground pins) with different geometric optimizations. This segmentation allows each type to be independently designed for its specific electrical function while maintaining an overall organized and manageable socket structure
Solution Approach 2:
The patent implements universality by designing a heterogeneous socket contact structure that simultaneously achieves multiple electrical performance goals including impedance control, signal integrity, crosstalk reduction, and insertion loss minimization within a single integrated socket design
3Strength
If traditional socket design is used, then mechanical integrity is maintained, but electrical performance scaling for high-speed links is limited
Solution Approach 1:
The patent applies local quality by optimizing specific regions of the socket contacts for different requirements. Mechanical support structures maintain traditional robust designs while signal transmission regions incorporate optimized geometries for high-speed electrical performance, allowing simultaneous achievement of mechanical strength and electrical scalability
Solution Approach 2:
The patent implements composite materials by combining different contact geometries and configurations within the same socket structure. This composite approach allows integration of mechanically robust elements with electrically optimized elements, achieving both mechanical integrity and high-speed data transmission capability
Data Source
AI summary
A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.