Heterogeneous Thermal Interface for High Voltage Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High voltage electronic devices face a challenge in finding materials that balance dielectric strength for electrical insulation and thermal conductivity for heat dissipation, as traditional dielectric materials have poor thermal properties and thermal interface materials have poor dielectric properties, leading to suboptimal performance in dual-layer configurations.
Innovation Solution
A heterogeneous thermal interface is created using distinct dielectric and thermally conductive materials, where the dielectric material forms a cutout to house the thermally conductive material, providing effective electrical isolation and heat transfer without the need for specialized materials engineered for both properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dielectric material is used to electrically isolate the electronic device from the substrate, then electrical insulation is improved, but thermal conductivity deteriorates
Solution Approach 1:
The thermal interface is segmented into two distinct functional regions: a dielectric material region for electrical insulation and a thermally conductive material region for heat dissipation. This segmentation allows each region to be optimized for its specific function, resolving the contradiction between electrical insulation and thermal conductivity requirements.
Solution Approach 2:
Different regions of the thermal interface are assigned different material properties according to local requirements. The dielectric material is positioned where electrical insulation is critical, while the thermally conductive material is positioned where heat dissipation is needed. This local differentiation of material quality resolves the global contradiction between insulation and conduction.
2Temperature
If thermal interface material is used to conduct heat away from the device, then thermal conductivity is improved, but dielectric strength deteriorates
Solution Approach 1:
The thermal interface is divided into separate functional zones where thermally conductive material is placed specifically for heat dissipation and dielectric material is placed specifically for electrical insulation. This segmentation prevents the use of thermally conductive material in regions where electrical insulation is critical, thus maintaining dielectric strength while improving thermal management.
Solution Approach 2:
The interface material composition is locally optimized: thermally conductive material is applied locally at the heat generation site, while dielectric material is applied locally at positions requiring electrical isolation. This local quality differentiation allows simultaneous optimization of both thermal and electrical performance.
3Reliability
If a dual layer configuration of dielectric and thermal interface layers is used, then both electrical insulation and thermal conductivity are improved, but thermal performance deteriorates due to significant reduction
Solution Approach 1:
The invention merges the dielectric and thermally conductive materials into a single integrated thermal interface structure rather than using separate layered configurations. This merging eliminates the thermal resistance interface between two distinct layers, allowing direct thermal conduction from the electronic device through the thermally conductive material while maintaining electrical insulation through the dielectric material's strategic positioning.
Solution Approach 2:
The thermal interface uses a composite structure combining dielectric and thermally conductive materials in a single interface layer rather than separate layers. This composite approach allows the materials to work together synergistically, with the thermally conductive material providing heat dissipation pathways and the dielectric material providing electrical insulation, thereby achieving both functions without the thermal penalty of separate layering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces operating temperatures of electronic devices by 10° to 70° C compared to prior art, enhancing thermal management and extending device lifespan while maintaining electrical safety.
Implementation Method 1
the thermally conductive material is positioned within a cutout of the dielectric material, forming a sandwich structure that enhances both electrical insulation and heat transfer
Implementation Method 2
The thermal interface includes at least two distinct materials, a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located.
Data Source
AI summary
An electronic apparatus, such as a lighting fixture, includes a substrate, an electronic device such as a chip-on-board light emitting diode and a thermal interface located between the substrate and the electronic device. The thermal interface includes at least two distinct materials, including a dielectric material and a thermally conductive material. The dielectric material includes a cutout into which the thermally conductive material is located. The dielectric material can completely surround the perimeter of the electronic device or can be located proximate portions of the electronic device that are prone to arcing in order to protect the substrate from arcing. The electronic apparatus operates at a reduced temperature as compared to an electronic apparatus that does not include the thermal interface. Methods for making an electronic apparatus having a thermal interface with a discrete dielectric material and thermally conductive material are also described.