Heterostructure Stress Management via Alternating Sub-layers

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Solution Overview

Problem

The growth of high-quality aluminum nitride (AlN) buffer layers on substrates like sapphire, silicon carbide, and silicon is challenging due to high dislocation density and stress issues, which affects the efficiency and reliability of deep ultraviolet light emitting diodes (DUV LEDs).

Innovation Solution

A heterostructure with alternating sub-layers of different group III nitride materials, where the thin sub-layers have a distinct composition from the intervening sub-layers, are used to control stresses and reduce wafer bowing during epitaxial growth, incorporating thin sub-layers of AlN or other nitride materials with varying gallium molar fractions to manage tensile and compressive stresses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If thick AlGaN epitaxial layers are grown to reduce current crowding, then device efficiency improves, but tensile strain and cracking increase

Engineering Contradiction:
Improvedevice efficiencyVSAvoidlayer integrity
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The thick AlGaN layer is segmented into multiple sub-layers with alternating compositions (Al-rich and Ga-rich regions), allowing the total thickness to be maintained for current spreading while individual sub-layers remain thin enough to avoid cracking from tensile strain

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses composite AlGaN structures with varying aluminum compositions (x values) arranged in specific patterns, creating a material system that combines the current-spreading benefit of thick layers with the strain-resistance of compositionally modulated regions

Inventive Principle:
Principle #40Composite materials

2Reliability

If AlN buffer layers are grown on sapphire or SiC substrates to improve crystal quality, then dislocation density decreases, but growth difficulty increases due to lattice mismatch

Engineering Contradiction:
Improvecrystal qualityVSAvoidgrowth difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The buffer layer structure is designed with locally varying compositions, including graded AlN layers transitioning to AlGaN layers with specific aluminum fractions, allowing optimal lattice matching at each interface while maintaining overall crystal quality

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent systematically varies composition parameters (aluminum fraction x), layer thickness parameters, and growth conditions across different layers to optimize both crystal quality and growth feasibility on different substrate types

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If superlattice structures are used to reduce biaxial tensile strain, then layer stability improves, but manufacturing complexity increases

Engineering Contradiction:
Improvelayer stabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The superlattice is segmented into repeating units of thin AlN and AlGaN layers, where each unit cell is relatively simple to grow but the repeated pattern provides cumulative strain management over the thickness of the layer

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs periodic alternation of AlN and AlGaN layers with specific thickness ratios, creating a regular pattern that systematically manages strain accumulation while maintaining a manageable manufacturing process through repetition

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces internal stresses and wafer bowing, leading to improved crystal quality and reduced dislocation density, enhancing the efficiency and reliability of DUV LEDs by balancing tensile and compressive stresses during growth and cool-down processes.

Implementation Method 1

The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure

Methodology Applied
Scientific EffectStress management through compositional variation:

Data Source

PatentUS10199531B2Semiconductor heterostructure with stress management
Publication Date: 2019.02.05 SENSOR ELECTRONIC TECHNOLOGY INC
  • US10199531B2 patent drawing
  • US10199531B2 patent drawing
  • US10199531B2 patent drawing

AI summary

A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding layer, that includes thin sub-layers inserted therein. The thin sub-layers can be spaced throughout the layer and separated by intervening sub-layers fabricated of the material for the layer. The thin sub-layers can have a distinct composition from the intervening sub-layers, which alters stresses present during growth of the heterostructure.