Hexagonal Bonding Surface Structure for Semiconductor Resin Adhesion
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Solution Overview
Problem
In semiconductor modules, the adhesion between the bonding portion of the metal wiring board and the sealing resin is compromised due to internal stress fluctuations caused by temperature changes, leading to potential distortion and reduced adhesion.
Innovation Solution
The semiconductor module incorporates a metal wiring board with a plate-shaped bonding portion bonded to the semiconductor element via a bonding material, and features a plurality of roughened recessed portions on the bonding portion's surface, each with a hexagonal shape in plan view, to enhance surface roughness and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal wiring board is solder-bonded to the semiconductor element surface, then electrical connection is achieved, but distortion occurs in the bonding portion due to internal stress fluctuation with temperature change
Solution Approach 1:
The patent applies the porous materials principle by forming recessed portions (dimples) on the bonding surface of the metal wiring board. These recessed portions create a porous-like surface structure that increases surface area and provides mechanical interlocking with the sealing resin, thereby improving adhesion strength and resistance to thermal stress-induced distortion.
Solution Approach 2:
The patent applies the spheroidality principle by forming curved, dome-shaped recessed portions on the bonding surface. These curved surfaces provide better stress distribution and mechanical interlocking compared to flat surfaces, enhancing the adhesion between the metal wiring board and sealing resin under thermal stress conditions.
2Reliability
If the bonding surface is made smooth for easy manufacturing, then manufacturing simplicity is maintained, but adhesion strength between the metal wiring board and sealing resin decreases
Solution Approach 1:
The patent applies the parameter changes principle by modifying the surface topology parameter of the bonding surface. Instead of keeping the surface smooth, the patent introduces recessed portions with specific depth, diameter, and spacing parameters that optimize adhesion strength while maintaining manufacturability through conventional forming processes.
3Stability of the object's composition
If internal stress is reduced to prevent distortion, then bonding portion stability improves, but adhesion strength between the metal wiring board and sealing resin decreases
Solution Approach 1:
The patent applies the local quality principle by creating localized recessed portions at specific locations on the bonding surface. This local modification provides enhanced adhesion and stress absorption exactly where needed at the bonding interface, while the overall bonding portion structure maintains its stability and resistance to thermal distortion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of roughened recessed portions significantly improves the adhesion between the metal wiring board's bonding portion and the sealing resin, effectively mitigating the effects of thermal stress and preventing peeling.
Implementation Method 1
a plurality of roughened recessed portions that roughen an upper surface of the bonding portion are provided
Data Source
AI summary
A semiconductor module, including: a stacked substrate, which includes an insulating plate, and a plurality of circuit boards formed on an upper surface of the insulating plate; a semiconductor element formed on an upper surface of one of the plurality of circuit boards; and a metal wiring board formed on an upper surface of the semiconductor element. The metal wiring board has a plate-shaped bonding portion bonded to the upper surface of the semiconductor element via a bonding material. The plate-shaped bonding portion has a plurality of recessed portions formed on an upper surface thereof, each recessed portion is of a hexagonal shape in a plan view of the semiconductor module.