Hexagonal GAA Memory Cell Layout for Die Size Reduction

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Solution Overview

Problem

Current memory devices face challenges in optimizing the design and fabrication of memory cells to enhance performance and reduce die size, particularly in achieving efficient gate control and capacitor integration.

Innovation Solution

The implementation of an array of hexagonal memory cells with gate-all-around (GAA) transistors coupled to capacitors, utilizing a folded architecture and airgap integration to reduce interconnect congestion and enhance design control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional memory cell designs are used, then fabrication processes are simpler, but gate control efficiency and capacitor integration are suboptimal

Engineering Contradiction:
Improvegate control efficiencyVSAvoidmemory cell structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from planar 2D memory cell layouts to hexagonal cells with 3D gate-all-around transistor structures. The gate wraps around the channel from all directions (top, bottom, sides), providing superior electrostatic control compared to conventional planar gates, while the hexagonal geometry optimizes space utilization and interconnect routing in the planar dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The gate structure is nested around the channel region in a concentric arrangement, with the gate electrode surrounding the channel from multiple directions. This nested configuration maximizes the gate's control over the channel while minimizing the footprint, directly addressing the contradiction between control efficiency and structural complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If more interconnects are added to memory cells, then functionality increases, but interconnect congestion and die size increase

Engineering Contradiction:
Improvememory cell functionalityVSAvoiddie size
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The hexagonal memory cell geometry enables interconnects to route along the six symmetric sides of the hexagon, utilizing the peripheral space more efficiently. This dimensional optimization allows multiple bit lines and word lines to access the cell without excessive congestion, maintaining functionality while reducing the area required per cell compared to conventional rectangular layouts.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The hexagonal cell structure provides six equivalent sides that can all serve as interconnect access points, making the cell universally accessible from multiple directions. This multi-directional accessibility reduces the need for dedicated long interconnect routes, thereby reducing overall interconnect congestion and die size while maintaining full cell functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250133720A1Memory device having hexagonal memory cells
Publication Date: 2025.04.24 MICRON TECHNOLOGY INC
  • US20250133720A1 patent drawing
  • US20250133720A1 patent drawing
  • US20250133720A1 patent drawing

AI summary

A variety of applications can include a memory device having an array of memory cells arranged as hexagonal cells, with each of the memory cells having a gate-all-around (GAA) transistor coupled to a capacitor. An access line can be coupled to gates of a first set of multiple GAA transistors of the memory cells. A digit line can be coupled to a second set of multiple GAA transistors of the memory cells, where the digit line is separated from an adjacent digit line by an airgap. Additional devices and methods are disclosed.