Hexagonal Heatsink with Feedback Fan Control

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Solution Overview

Problem

Existing heatsinks, particularly those of square or rectangular shapes, are limited in their ability to transfer heat efficiently due to their dimensions and shapes, leading to inadequate cooling in high-power electronic devices, which can result in overheating and reliability issues.

Innovation Solution

A hexagonal heatsink system with both passive and active cooling capabilities, featuring a hexagonal base plate with perpendicular fins and a feedback circuit that monitors temperature and adjusts fan operation to maintain optimal temperatures, enhancing heat dissipation and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a square or rectangular heatsink is used, then the design is simple and easy to manufacture, but the heat transfer area is limited and efficiency is reduced

Engineering Contradiction:
Improveease of manufactureVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent applies asymmetry by transitioning from conventional square/rectangular heatsink shapes to a hexagonal geometry. This asymmetric shape allows the heatsink to accommodate more fins and provide greater heat dissipation surface area while maintaining manufacturability through standardized hexagonal machining processes. The hexagonal form factor enables optimized fin arrangement that maximizes heat transfer efficiency.

Inventive Principle:
Principle #4Asymmetry

2Productivity

If the heatsink area is increased to transfer more heat, then heat transfer efficiency improves, but the device occupies more space and becomes less compact

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidheatsink area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent employs dimensional optimization by arranging fins in multiple directions radiating from the hexagonal base plate. Instead of simply expanding the heatsink footprint in one dimension, the design utilizes radial arrangement in two dimensions, allowing greater heat dissipation surface area within a compact footprint. The perpendicular fin arrangement in multiple orientations maximizes space utilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If passive cooling is used, then the device complexity is reduced, but the cooling capability is insufficient for high-power devices

Engineering Contradiction:
Improvedevice complexityVSAvoidcooling capability
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent implements dynamics by incorporating a fan that can be activated based on temperature feedback. The system transitions from static passive cooling to dynamic active cooling when thermal thresholds are exceeded. The feedback circuit monitors temperature and selectively activates the fan, providing adaptive cooling capability that maintains simplicity during normal operation while delivering enhanced cooling when needed.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hexagonal heatsink system effectively manages heat transfer, ensuring optimal operating temperatures and improving the reliability and efficiency of electronic devices by utilizing a feedback circuit to regulate cooling based on temperature thresholds, thereby preventing overheating.

Implementation Method 1

heatsinks are crucial components in optoelectronic devices, designed to transfer heat away from processing components

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the choice between forced-convection and natural-convection cooling

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the choice between forced-convection and natural-convection cooling

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 4

the choice of thermal interface materials, such as thermal adhesive or thermal paste, plays a pivotal role in enhancing the heat sink's performance by filling air gaps between the heat sink and the device's heat spreader

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240179869A1Hexagonal heatsink system
Publication Date: 2024.05.30 LIGHTSPEED PHOTONICS PTE LTD
  • US20240179869A1 patent drawing
  • US20240179869A1 patent drawing
  • US20240179869A1 patent drawing

AI summary

The hexagonal heatsink system introduces a novel approach to efficient electronic device cooling. It includes heatsink devices, each with an electronic circuit board and heatsink elements for heat transfer, all attached via a hexagonal base plate with fins for enhanced cooling. Temperature sensors are placed near processors strategically to monitor temperature values. The system employs a feedback circuit that collects sensor data, calculates an effective temperature, and regulates a fan based on the comparison with a threshold temperature. It can control additional fan parameters, such as speed. This system offers an effective solution for maintaining optimal operating temperatures in electronic devices, particularly those with hexagonal base plates, improving overall device reliability and preventing overheating even in server racks.