Hexagonal Via Structures for Thermal Dissipation
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Solution Overview
Problem
The challenge is to enhance thermal dissipation in semiconductor devices while addressing the mechanical stress caused by coefficient of thermal expansion (CTE) mismatches between the semiconductor die and the printed circuit board (PCB).
Innovation Solution
A semiconductor package design featuring a substrate with hexagonally arranged vias and capture pads, which provides efficient thermal conductivity and structural stability, allowing for effective heat dissipation and electrical connections, and includes a method of fabricating the package using laser drilling techniques to create via openings and plating to form conductive vias and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If efficient heat transfer paths are implemented through the PCB, then thermal dissipation is improved, but mechanical stress increases due to CTE mismatch between die and PCB
Solution Approach 1:
The patent introduces an intermediary layer structure between the die and PCB that includes multiple via structures filled with conductive material. This intermediary thermal management structure serves as a mediator that provides heat transfer paths while accommodating CTE differences, thereby reducing mechanical stress on the die-PCB interface.
Solution Approach 2:
The via structures are filled with composite conductive materials that provide both thermal conductivity for heat dissipation and mechanical compliance to accommodate CTE mismatches. The composite nature of these materials allows simultaneous optimization of thermal performance and stress reduction.
2Temperature
If multiple via structures are implemented for thermal dissipation, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal management system is segmented into multiple discrete via structures distributed throughout the substrate. Each via structure is an independent heat transfer path, allowing modular implementation and optimization without requiring complex integrated solutions. The segmentation enables scalable design based on thermal requirements.
Solution Approach 2:
The via structures serve multiple functions simultaneously: they provide thermal conduction paths for heat dissipation, electrical connection paths for signal routing, and mechanical reinforcement elements for structural stability. This multi-functionality reduces overall device complexity by consolidating multiple requirements into single structural elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal dissipation efficiency while reducing mechanical stress and maintaining structural integrity, offering a balanced solution for heat removal and electrical connectivity.
Implementation Method 1
A substrate is provided having a first plurality of vias disposed therein and arranged in a hexagonal pattern... efficient thermal conductivity and structural stability, allowing for effective heat dissipation
Implementation Method 2
a method of fabricating the package using laser drilling techniques to create via openings
Implementation Method 3
plating to form conductive vias and pads
Data Source
AI summary
An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.