High-Frequency Connector With Elastic Probe Contact for PCB Gaps
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Solution Overview
Problem
Conventional end-launch type connectors for high-frequency circuit tests suffer from gaps between the printed circuit board and the central probe module, leading to parasitic capacitance that affects signal frequency and bandwidth, compromising test accuracy.
Innovation Solution
A high-frequency connector design featuring a central probe module movably mounted in a main channel with a central elastic unit to ensure contact with the printed circuit board, and optional abutting elastic units to prevent gaps, reducing parasitic capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional end-launch type connectors use multiple components to clamp and fix the printed circuit board, then the connector can accommodate different board thicknesses and is reusable, but gaps form between the board edge and the central probe module due to cumulative tolerances, leading to parasitic capacitance
Solution Approach 1:
The connector is divided into multiple functional modules: a clamp module for fixing the board, a central probe module for signal contact, and an elastic unit for applying pressure. This segmentation allows each module to be optimized independently - the clamp module handles board fixation with adaptability to different thicknesses, while the elastic unit ensures the central probe module maintains precise contact without gaps, thereby resolving the manufacturing precision issue.
2Device complexity
If conventional connectors rely on fixed positioning of the central probe module, then the structure is simple, but gaps form due to tolerance accumulation, affecting high-frequency signal integrity
Solution Approach 1:
The central probe module is designed to be movable rather than fixed, enabled by the elastic unit. This dynamic design allows the probe module to automatically adjust its position to eliminate gaps with the board edge, ensuring consistent signal integrity. The elastic unit provides continuous pressure to maintain optimal contact, transforming a static tolerance problem into a dynamic self-adjusting system.
3Ease of manufacture
If gaps are allowed between the central probe module and printed circuit board to simplify assembly, then manufacturing is easier, but parasitic capacitance accumulates, affecting test accuracy
Solution Approach 1:
The elastic unit is designed to automatically apply pressure to the central probe module, making the connector self-adjusting during assembly. When the board is inserted, the elastic unit naturally pushes the probe module into contact with the board edge without requiring precise manual positioning. This self-service mechanism eliminates gaps and reduces parasitic capacitance while keeping the assembly process simple and straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures consistent contact without gaps, improving signal integrity and test accuracy by minimizing parasitic capacitance, suitable for high-frequency circuit testing.
Implementation Method 1
a central elastic unit to ensure contact with the printed circuit board
Data Source
AI summary
A high-frequency connector has a main body, a clamp module, a central probe module, a central elastic unit, a front unit, and a front probe module. The clamp module and the front unit are mounted on the main body. The central probe module is movably mounted in a main channel of the main body and protrudes from a mounting surface of the main body. The front probe module is mounted in a front channel of the front unit and movably connected to the central probe module. The central elastic unit is mounted in the main channel and abuts the central probe module and the front probe module. When a printed circuit board is connected to the high-frequency connector, the central elastic unit keeps pressing the central probe module to prevent formation of a gap between the printed circuit board and the central probe module, reducing the parasitic capacitance.