High-Frequency Filter Layout for Simultaneous Communication Isolation

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Solution Overview

Problem

In multiplexers using acoustic wave filters, ensuring isolation between filters during simultaneous communication is challenging, particularly when filters are adjacent to each other.

Innovation Solution

A high-frequency module configuration with a mounting substrate and three filters, where the third filter is disposed between the first and second filters, ensuring isolation during simultaneous communication by using common piezoelectric substrates for the filters involved in communication and separate substrates for filters not used in simultaneous communication.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If two acoustic wave filters are disposed adjacent to each other for simultaneous communication, then the device area is reduced, but isolation between the filters cannot be ensured

Engineering Contradiction:
Improvedevice areaVSAvoidisolation between filters
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

A third filter is introduced as an intermediary element disposed between the first and second filters. This third filter acts as a mediator that provides isolation between the first and second filters used for simultaneous communication, while still allowing compact arrangement of all three filters on the mounting substrate.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Length of moving object

If filters are disposed adjacent to each other, then the signal path length is reduced, but bundle losses increase due to poor isolation

Engineering Contradiction:
Improvesignal path lengthVSAvoidbundle losses
Core Design Contradiction:
Length of moving objectVSLoss of energy

Solution Approach 1:

The third filter serves as an intermediary structure that provides isolation between the first and second filters. This isolation prevents signal leakage and reduces bundle losses while maintaining short signal path lengths, as all three filters are disposed adjacently on the same mounting substrate without requiring additional isolation structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20230291427A1High-frequency module, filter device, and communication device
Publication Date: 2023.09.14 MURATA MFG CO LTD
  • US20230291427A1 patent drawing
  • US20230291427A1 patent drawing
  • US20230291427A1 patent drawing

AI summary

A high-frequency module includes a mounting substrate, a first filter, a second filter, and a third filter. The mounting substrate has a first main surface and a second main surface opposite to each other. Simultaneous communication is enabled for the first filter and the second filter, and the third filter is not used in the simultaneous communication using the first filter and the second filter. The first filter, the second filter, and the third filter are mounted on the first main surface of the mounting substrate. A first substrate of the first filter, a second substrate of the second filter, and a third substrate of the third filter are common to each other. The third filter is disposed between the first filter and the second filter in plan view from a thickness direction of the mounting substrate.