High-Frequency Module Thermal Path Layout for Filter Heat Dissipation
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Solution Overview
Problem
Existing high-frequency modules have insufficient heat dissipation properties for electronic components such as filters and power amplifiers.
Innovation Solution
A high-frequency module design incorporating a mounting substrate, a resin layer, a shielding layer, and a metal member, where the resin layer covers the outer peripheral surfaces of the electronic components and the shielding layer is connected to ground, with the metal member providing additional heat dissipation paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation structures are used, then device simplicity is maintained, but heat dissipation performance is insufficient
Solution Approach 1:
The heat dissipation function is segmented into multiple independent paths: the resin layer provides insulation and partial heat dissipation, the shielding layer provides electromagnetic shielding and heat dissipation, and the metal member provides additional heat dissipation. This segmentation allows each component to contribute to heat dissipation without requiring complete structural redesign.
Solution Approach 2:
The resin layer and shielding layer serve multiple functions: electrical insulation, electromagnetic shielding, and heat dissipation. The metal member simultaneously provides heat dissipation and structural support. This multi-functionality improves heat dissipation performance while avoiding significant increases in device complexity.
2Temperature
If additional heat dissipation paths are added, then heat dissipation performance improves, but device complexity increases
Solution Approach 1:
The heat dissipation function is merged into existing structural components. The resin layer, shielding layer, and metal member are integrated into the device architecture, with each component serving both its primary function and heat dissipation. This merging approach adds heat dissipation paths without significantly increasing the number of discrete components.
Solution Approach 2:
Existing structural components (resin layer, shielding layer, metal member) automatically provide heat dissipation functionality without requiring additional active cooling systems or complex thermal management mechanisms. The components serve themselves by conducting heat away from electronic components through their inherent thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves the heat dissipation properties of electronic components by increasing the number of heat dissipation paths, enhancing thermal management and isolation between components.
Implementation Method 1
The shielding layer is provided to a surface of the resin layer on the opposite side from the mounting substrate, covers at least a portion of the resin layer, and is connected to a ground
Implementation Method 2
The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate
Data Source
AI summary
A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.