High-Frequency Module Layout to Restrain Inductor Coupling
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Solution Overview
Problem
There is a desire to restrain coupling between inductors in high-frequency modules while ensuring a sufficient substrate layout area.
Innovation Solution
A high-frequency module design that includes a mounting substrate with inductors on opposite main surfaces, a shield layer connected by a conductive member to a high-frequency component, and a signal processing circuit for processing reception and transmission signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple inductors are provided on the main surface of the substrate, then the substrate layout area is ensured, but coupling between inductors increases
Solution Approach 1:
The patent moves at least one inductor from the main surface to the back surface of the substrate, transitioning the layout from a two-dimensional planar arrangement to a three-dimensional spatial distribution. This dimensional change allows inductors to be positioned farther apart, reducing electromagnetic coupling while maintaining adequate layout area on the main surface for other components.
Solution Approach 2:
The patent segments the inductor placements across two separate surfaces (main surface and back surface) of the substrate. By dividing the inductor locations into two spatial groups, the design reduces the density of inductors on any single surface, thereby minimizing mutual coupling effects while preserving the overall substrate layout area.
2Object-affected harmful factors
If a shield layer is added between inductors, then coupling between inductors is restrained, but device complexity increases
Solution Approach 1:
Instead of adding a shield layer between inductors, the patent extracts the shielding function by utilizing the substrate itself as a natural separator. The substrate's thickness and material properties provide inherent electromagnetic isolation, eliminating the need for additional shield layers and reducing structural complexity.
Solution Approach 2:
The patent introduces the substrate as an intermediary medium between inductors. By positioning inductors on opposite surfaces of the substrate, the substrate material acts as a natural electromagnetic barrier, reducing coupling without requiring additional shield components.
Data Source
AI summary
Coupling between inductors is restrained, and the layout area of a substrate is also ensured. A high-frequency module includes a mounting substrate, a first inductor, a second inductor, at least one high-frequency component, a shield layer, and a conductive member. The mounting substrate has a main surface. The first inductor is located on a main surface side of the mounting substrate. The second inductor is located on the main surface side of the mounting substrate. The high-frequency component is located on the main surface side of the mounting substrate and between the first inductor and the second inductor. The shield layer is connected to the ground. The conductive member connects the high-frequency component and the shield layer. The conductive member is connected to a main surface of the high-frequency component, the main surface facing the shield layer.