3D High-Frequency Module Layout for Component Isolation
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Solution Overview
Problem
High-frequency modules in mobile communication devices face challenges in reducing size while maintaining adequate isolation between electronic components, leading to potential interference and reduced signal quality.
Innovation Solution
A high-frequency module configuration with multiple substrates and electronic components arranged in three layers, including between, on, and within the substrates, to enhance isolation and reduce size, featuring power amplifiers, filters, and low-noise amplifiers strategically positioned to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are arranged in multiple layers between and on substrates, then the module size is reduced, but the isolation between components may deteriorate
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional multi-layer arrangement, placing components on both first and second substrates, between substrates, and within substrates. This spatial distribution in multiple dimensions reduces module footprint while maintaining component isolation through vertical separation.
Solution Approach 2:
The patent divides the module into distinct spatial zones: components on the first substrate, components on the second substrate, components between substrates, and components within substrates. This segmentation allows each component to occupy its own spatial domain, preventing interference while achieving compact integration.
2Volume of moving object
If components are placed closer together to reduce size, then manufacturing complexity increases due to precise positioning requirements
Solution Approach 1:
By utilizing the third dimension (vertical space between and within substrates), the patent achieves compact integration without requiring extreme lateral precision. Components are separated in the vertical dimension, reducing the stringency of lateral positioning requirements while maintaining small module dimensions.
Data Source
AI summary
A high-frequency module includes a module substrate including major surfaces opposite to each other; a module substrate including major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component including a filter coupled to a power amplifier; a second electronic component including a filter coupled to a low-noise amplifier; and a third electronic component (an integrated circuit) including the low-noise amplifier. The first electronic component is disposed one of between the major surfaces, on the major surface, and on the major surface. The second electronic component is disposed another one of between the major surface surfaces, on the major surface, and on the major surface. The third electronic component is disposed other one of between the major surfaces, on the major surface, and on the major surface.