High-Frequency Module Recess Layout for Low-Height Packaging
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Solution Overview
Problem
Existing high-frequency modules in mobile communication devices face an increase in height due to their complexity, which is not addressed by existing size reduction techniques.
Innovation Solution
A high-frequency module design incorporating a first and second module substrate with recesses on major surfaces to accommodate electronic components of varying heights, allowing for reduced size without increasing height, featuring electronic components disposed within and outside recesses on the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple substrates are used to reduce the size of the high-frequency module, then the planar size is reduced, but the height increases
Solution Approach 1:
The substrate surface is divided into different regions with different heights: a recess region for accommodating taller electronic components and a flat region for shorter components. This local quality differentiation allows the module to maintain compact planar size while controlling overall height by placing components in appropriately sized zones.
Solution Approach 2:
The recess is formed within the substrate structure, creating a nested configuration where the recess cavity is embedded in the substrate. This nesting approach allows taller components to be housed within the substrate volume rather than extending outward, thereby reducing the overall module height while maintaining planar footprint.
2Device complexity
If taller electronic components are used to reduce the number of components, then device complexity is reduced, but the module height increases
Solution Approach 1:
The substrate provides locally differentiated mounting surfaces with varying heights. Taller electronic components are placed in the recess region where the substrate surface is lower, while shorter components are placed on the flat region. This allows a mix of component heights without increasing overall module height, enabling component reduction while maintaining compact dimensions.
Solution Approach 2:
Instead of increasing height to accommodate fewer, taller components, the design uses the recess depth dimension to create vertical separation. The recess provides a lower elevation zone that allows taller components to be positioned without increasing the top surface height of the module, effectively using the substrate thickness dimension to manage component height variations.
Data Source
AI summary
A high-frequency module includes a first module substrate including first and second major surfaces, and a second module substrate including third and fourth major surfaces. The first major surface (faces the second major surface. Electronic components are disposed between the second and third major surfaces, on the first major surface, and on the fourth major surface. External connection terminals are disposed on the fourth major surface. A recess is formed in the first major surface. The electronic components include a first electronic component and a second electronic component (shorter in height than the first electronic component. The first electronic component is disposed in the recess, and the second electronic component is disposed in a region outside of the recess on the first major surface.