High-Frequency Module Layout for Secure External Connections
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Solution Overview
Problem
Existing high-frequency modules face challenges in miniaturization while securing external connection members.
Innovation Solution
The high-frequency module integrates an IC chip as an external connection member, utilizing a conductor layer connected via through-vias and connection terminals to the mounting substrate, allowing for double-sided component mounting without additional space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the module is reduced in size, then miniaturization is achieved, but the external connection member cannot be secured
Solution Approach 1:
The patent merges the electronic component and the external connection member into a single integrated structure. The conductor layer is formed on the electronic component to serve dual purposes: as an electrical conductor and as the external connection member, eliminating the need for separate external connection components and enabling module miniaturization while maintaining connection security
Solution Approach 2:
The conductor layer performs multiple functions simultaneously: it provides electrical conduction within the electronic component and serves as the external connection member for mounting substrate connection. This multi-functionality reduces the number of components needed and enables space savings for miniaturization
2Reliability
If additional external connection members are added, then connection security is improved, but the module size increases
Solution Approach 1:
The patent combines the functions of the electronic component and external connection member into a single integrated structure, where the conductor layer serves both purposes. This merging eliminates the need for additional separate external connection members, achieving connection security without increasing module size
Solution Approach 2:
The patent utilizes the surface area of the electronic component itself as the connection interface. By forming the conductor layer on the electronic component surface, the connection function is achieved within the existing component footprint without requiring additional space or larger module dimensions
Data Source
AI summary
To provide a high-frequency module that can be reduced in size while securing an external connection member. A high-frequency module includes a mounting substrate, an electronic component, and a resin layer. The electronic component is mounted on a main surface of the mounting substrate. The resin layer is provided on the mounting substrate and covers a side surface of the electronic component. The electronic component includes a connection terminal, a conductor layer, and a through-via. The connection terminal is provided on a main surface of the electronic component on the mounting substrate side, and is connected to the mounting substrate through a connection member. The conductor layer is provided on a main surface of the electronic component on a side opposite to the mounting substrate side. The through-via penetrates between the main surface and the main surface of the electronic component to connect the connection terminal and the conductor layer.