High-Frequency Module Layout Using Shared Inductors for Downsizing
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Solution Overview
Problem
Existing high-frequency modules are large in size due to the size of the inductors used, which hinders downsizing efforts in communication devices that require compact designs for advanced standards like 4G and 5G.
Innovation Solution
The high-frequency module incorporates a surface mount inductor on a common path between filters and amplifiers, with additional inductors integrated within the IC chip or formed on the mounting substrate, allowing for a more compact design by sharing inductance and reducing the size of individual inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each amplifier is connected to its own dedicated inductor on separate paths, then the inductance performance and Q-value are maintained, but the module size becomes large
Solution Approach 1:
The patent combines multiple inductors into a single shared inductor that is commonly used by multiple amplifiers. This merging approach reduces the total number of inductor components and their occupied area on the module, directly addressing the size reduction goal while maintaining the necessary inductance function through the shared component.
Solution Approach 2:
The shared inductor is designed to serve multiple amplifiers simultaneously, making it a universal component that performs the same inductance function for different signal paths. This multi-functionality allows a single component to replace what would traditionally require multiple dedicated inductors, achieving downsizing without sacrificing performance.
2Reliability
If multiple separate inductors are used for multiple amplifiers, then the inductance requirements are met, but the Q-value deteriorates due to larger overall inductance structure
Solution Approach 1:
By merging multiple inductor functions into a single shared inductor, the patent reduces the overall inductance structure size. This consolidation helps maintain higher Q-value because the single inductor can be optimized with fewer parasitic elements and lower resistance compared to multiple separate inductors that would collectively occupy more space and introduce more losses.
3Ease of operation
If dedicated inductors are provided for each amplifier path, then the signal path independence is maintained, but the device complexity increases
Solution Approach 1:
The patent merges multiple inductor components into a single shared inductor, reducing the device complexity by minimizing the number of passive components. Despite this reduction, the signal path independence is maintained through the switching mechanism that selectively connects different amplifiers to the shared inductor, ensuring that each signal path remains independent when actively used.
Data Source
AI summary
In a high-frequency module, a plurality of filters are connected to a first switch. A plurality of amplifiers are connected to a second switch. A first inductor is disposed on a common path between a second common terminal of the second switch and a first common terminal of the first switch. A plurality of second inductors are disposed, on a one-to-one correspondence, in sections different from the common path, the sections being included in the plurality of respective signal paths. The first inductor is a surface mount inductor located on a first main surface of a mounting substrate. The plurality of second inductors are each an inductor disposed within an IC chip including the plurality of amplifiers or an inductor including a conductive pattern formed in or on the mounting substrate.