High-Frequency Package Mounting Structure for Low-Reflection Lead Pins
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Solution Overview
Problem
The existing mounting mechanisms for high-frequency lead pins in optical communication modules lack flexibility in design, resulting in limited freedom for high-frequency signal transmission, leading to high reflection loss and suboptimal propagation characteristics.
Innovation Solution
A mounting structure featuring a high-frequency package with a multilayer coplanar line configuration, including signal and ground lead pins with recessed and bent portions, and a multilayer substrate with coplanar lines, which reduces reflection loss by aligning tip positions and optimizing electromagnetic field distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the lead pin configuration follows standardization specifications, then the package can be mounted on standardized substrates, but the degree of freedom for high-frequency design is reduced
Solution Approach 1:
The patent applies local quality by providing a recess structure specifically in the arrangement region of the signal lead pin on the side face of the package housing. This localized structural modification allows optimization of high-frequency characteristics in the critical mounting region while maintaining standard lead pin configurations for compatibility, thus resolving the contradiction between mounting compatibility and design freedom.
2Reliability
If the gap between ground lead pin and signal lead pin is narrowed, then high-frequency characteristics are improved, but manufacturing precision requirements increase
Solution Approach 1:
The recess structure is formed in advance in the package housing during manufacturing, which preliminarily positions the signal lead pin arrangement region. This preliminary action ensures that when lead pins are mounted, they naturally achieve the optimized gap distances required for high-frequency performance, thereby reducing the actual manufacturing precision requirements during the lead pin mounting process.
3Ease of manufacture
If the lead pin structure is simplified for easy mounting, then manufacturing ease is improved, but high-frequency signal propagation characteristics deteriorate
Solution Approach 1:
The package housing structure is segmented by introducing a recess portion in the signal lead pin arrangement region. This segmentation creates distinct functional zones: the recess region for optimized high-frequency signal propagation and the rest of the housing for standard mounting functions. This allows the structure to simultaneously achieve ease of manufacture through standardized mounting procedures and improved signal propagation through the specialized recess geometry.
Data Source
AI summary
An embodiment is a mounting structure including a high-frequency package and a mounting substrate on which the high-frequency package is mounted. In an area of a portion where a first signal lead pin and a second signal lead pin are in contact with the package housing on the bottom surface side, a recess is provided in the package housing. The recess toward the inside of the package housing up to a portion before the connection portion between the signal lead pins and the package conductor layer in the arrangement region of the signal lead pins on the side face of the package housing on the tip side of the signal lead pins.