High-Frequency Package Lead Pitch Adjustment for Impedance Matching
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Solution Overview
Problem
Existing high-frequency signal device packages face limitations in designing electromagnetic coupling between signal lines due to standardized lead pin positions, restricting the freedom to adjust pitch intervals and shapes, which hinders optimal impedance matching and high-frequency characteristics.
Innovation Solution
A manufacturing method for a high-frequency package involving the use of lead frames with adjustable lead pin intervals, where lead frames are connected to signal and ground pads, separated, and adjusted to align pitch widths, allowing for customizable lead pin configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standardized lead pin configurations are used, then manufacturing consistency and compatibility are improved, but design freedom for electromagnetic coupling and impedance matching deteriorates
Solution Approach 1:
The lead pin configuration is divided into multiple segments with different pitch intervals. The first lead pin has a first pitch interval and the second lead pin has a second pitch interval, allowing each segment to be optimized independently for electromagnetic coupling while maintaining standardized manufacturing processes for each segment
Solution Approach 2:
Different regions of the lead pin structure are given different properties. The first and second lead pins have different pitch intervals tailored to their specific electromagnetic coupling requirements, while other standardized regions maintain uniform specifications for manufacturing consistency
2Ease of manufacture
If equal pitch intervals are used for all lead pins, then manufacturing simplicity is improved, but high-frequency characteristics and impedance matching deteriorate
Solution Approach 1:
The pitch interval is varied locally at specific lead pin positions rather than uniformly across all pins. The first pitch interval between first and second lead pins differs from the second pitch interval, allowing optimization of electromagnetic coupling in critical high-frequency regions while maintaining simpler manufacturing in other areas
Solution Approach 2:
The pitch interval parameter is changed at specific locations to optimize high-frequency performance. By adjusting the pitch interval between lead pins in critical coupling regions, the electromagnetic characteristics are improved without requiring complete redesign of the entire lead pin array
3Reliability
If lead pin intervals are adjusted for optimal electromagnetic coupling, then high-frequency design performance is improved, but manufacturing complexity increases
Solution Approach 1:
The lead pin array is segmented into groups with different pitch intervals. This segmentation allows optimization of electromagnetic coupling in specific regions while maintaining regular, easily manufacturable patterns in other regions, reducing overall manufacturing complexity
Solution Approach 2:
The different pitch intervals are built into the lead frame structure during manufacturing preparation. By pre-configuring the first and second pitch intervals in the lead frame before assembly, the complex electromagnetic coupling requirements are satisfied without adding complexity to the final assembly process
Data Source
Figure 1A~1B
Figure 1C~1E
Figure 1F~1G
AI summary
After a distal end portion (114b) of a first lead (114) of a first lead frame (110) is connected to a first signal pad (104), and a distal end portion (115b) of a second lead (115) is connected to a second signal pad (105), the interval between the linear portion of the first lead (114) and the linear portion of the second lead (115) is adjusted using a lead shape changing jig (122).