High-Frequency Switch Module With LC Resonant Isolation Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency switch modules experience signal leakage between selection target terminals, leading to deteriorated transmission characteristics in multiple communication bands, which affects the performance of radio communication apparatuses.
Innovation Solution
Incorporating a filter circuit with multiple attenuation poles between switch elements' selection target terminals, utilizing LC parallel resonant circuits with different resonant frequencies to ensure high isolation between transmission paths, and integrating these components into a single package to downsize the switch module while maintaining high isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a common antenna is shared in a plurality of communication bands, then the miniaturization of the front-end circuit is achieved, but signal leakage occurs between selection target terminals leading to deteriorated transmission characteristics
Solution Approach 1:
A filter circuit is introduced as an intermediary component between the switch element and the antenna. This filter circuit includes attenuation poles positioned at the fundamental frequency and harmonic components of communication signals, thereby suppressing signal leakage between different communication bands while maintaining the shared antenna configuration for miniaturization.
2Reliability
If a filter circuit with multiple attenuation poles is added between selection target terminals, then signal leakage is suppressed and transmission characteristics are improved, but the device complexity increases
Solution Approach 1:
The filter circuit is designed to serve multiple functions simultaneously: it suppresses signal leakage at the fundamental frequency of communication signals and also attenuates harmonic components. By integrating these multiple filtering functions into a single filter circuit structure, the patent achieves improved transmission characteristics without proportionally increasing device complexity.
3Volume of moving object
If the switch module is downsized by integrating components into a single package, then the front-end circuit miniaturization is enhanced, but the isolation between transmission paths may be compromised
Solution Approach 1:
The filter circuit is integrated within the switch module package, creating a nested structure where the filter is contained within the overall switch assembly. This nesting approach allows the module to be downsized while maintaining the functional isolation between transmission paths through the carefully positioned attenuation poles in the filter circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses signal leakage and transmission losses, ensuring high isolation between communication bands and reducing the size of the switch module, making it suitable for carrier aggregation applications.
Implementation Method 1
The filter circuit is connected between the first selection target terminal and the second selection target terminal and has a plurality of attenuation poles. By setting the fundamental frequency of a communication signal transmitted via the second selection target terminal and the frequency of a harmonic component of the communication signal as frequencies at the attenuation poles of the filter circuit
Implementation Method 2
utilizing LC parallel resonant circuits with different resonant frequencies to ensure high isolation between transmission paths
Data Source
AI summary
A high-frequency switch module (10) includes a switch element (20) and LC parallel resonant circuits (31 and 32). The switch element (20) includes selection target terminals (P14 and P21) used to transmit communication signals using different frequencies. The LC parallel resonant circuits (31 and 32) are connected between a connection conductor (901) connected to the selection target terminal (P14) and a connection conductor (902) connected to the selection target terminal (P21). The LC parallel resonant circuits (31 and 32) are connected in series between the connection conductors (901 and 902). The LC parallel resonant circuits (31 and 32) have different attenuation pole frequencies.