High Frequency Integrated Circuit Signal Splitter Attenuator Switches
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Solution Overview
Problem
High frequency integrated circuits used in wireless communication devices face challenges in meeting the varying specifications of different communication standards, such as 3G, 4G, and 5G, as existing solutions like variable gain amplifiers and signal splitters fail to maintain optimal insertion loss and isolation while outputting multiple signals with different gains.
Innovation Solution
A high frequency integrated circuit design incorporating a signal splitter, attenuator, conductive elements, and switches that allow for multiple power levels and gain settings by selectively routing high frequency signals through conductive elements and attenuators, ensuring minimal insertion loss and isolation, and enabling output from multiple high frequency output terminals with varying power levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a variable gain amplifier and signal splitter are used to output multiple signals with different gains, then the requirement for multiple power levels is met, but insertion loss and isolation deteriorate
Solution Approach 1:
The circuit is segmented into multiple independent signal paths, each with its own switch and attenuator setting. This allows each path to be optimized independently for low insertion loss while providing multiple output power levels through selective activation of different paths.
Solution Approach 2:
The circuit uses dynamically controllable switches to select between different signal paths and attenuator settings based on the required output power level. This dynamic switching capability enables the system to adapt to different communication standards and requirements while maintaining optimal performance for each configuration.
2Adaptability or versatility
If communication standards are adapted for higher frequency and higher functionality, then versatility improves, but circuit complexity increases
Solution Approach 1:
The circuit is designed with universal components and configurations that can serve multiple communication standards (3G, 4G, 5G). By using a standardized attenuator and switch architecture, the same circuit can be configured for different standards without requiring completely separate designs, thereby reducing overall complexity.
Solution Approach 2:
The circuit achieves adaptability to different communication standards by changing parameters such as attenuator settings and switch configurations rather than redesigning the entire circuit. This parameter-based adaptation allows the same physical circuit to meet different specification requirements.
Data Source
AI summary
According to an embodiment, a high frequency integrated circuit includes a signal splitter, an attenuator, a first conductive element, and first to eighth switches. The signal splitter receives a high frequency signal at an input terminal, splits the high frequency signal to two lines, and outputs the signals split into the two lines from a first output terminal and a second output terminal. The attenuator has multiple amounts of attenuation values. In the first conductive element, a first amount of attenuation is set. The high frequency integrated circuit outputs a plurality of output signals having different gain values from the first high frequency output terminal and the second high frequency output terminal, respectively.