Head Gimbal Assembly Flexure Bonding for Windage Oscillation

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Solution Overview

Problem

The head gimbal assembly in disk devices is susceptible to wind-generated oscillations due to the thinness of the flexure, compromising the accurate positioning of the magnetic head.

Innovation Solution

A head gimbal assembly is designed with an adhesive applied between the base plate and the flexure to bond them securely, preventing swing and oscillation caused by windage, and enhancing the bonding strength by using a pocket for the adhesive application.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the flexure is made thin to reduce weight and improve flexibility, then the magnetic head can be positioned more precisely, but the flexure becomes highly susceptible to windage and oscillates more easily

Engineering Contradiction:

Improvepositioning accuracy of magnetic headVSAvoidstability of flexure against windage

Core Design Contradiction:

Measurement precisionVSStability of the object's composition

Solution Approach 1:

The patent introduces adhesive as an intermediary substance between the flexure and the base plate. This adhesive layer acts as a mediator that transfers and distributes the windage forces across a larger area, preventing the thin flexure from oscillating while maintaining its thin profile for precise positioning.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent merges the flexure with the base plate through adhesive bonding. By combining these two components into a more integrated structure, the stability of the base plate is transferred to the flexure, reducing windage susceptibility while preserving the flexure's thin characteristics for positioning accuracy.

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If adhesive is applied between the base plate and the flexure to suppress oscillation, then the stability and positioning accuracy improve, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvestability of flexureVSAvoidcomplexity of bonding structure

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent applies adhesive only in specific localized areas between the base plate and the flexure, rather than uniformly across the entire surface. This localized bonding approach suppresses oscillation effectively while minimizing the added complexity and maintaining ease of manufacturing.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses a simple adhesive material that is inexpensive and easy to apply, rather than complex mechanical bonding structures. This disposable-like bonding approach provides effective stabilization without significantly increasing device complexity or manufacturing difficulty.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Strength

If adhesive is applied to bond the flexure to the base plate, then the bond strength increases and oscillation is suppressed, but the manufacturing precision and process control become more difficult

Engineering Contradiction:

Improvebond strength between flexure and base plateVSAvoidprecision of adhesive application

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent performs preliminary preparation of the bonding surfaces of the base plate and flexure before applying the adhesive. This preliminary action ensures proper surface cleanliness and compatibility, which strengthens the bond while simplifying the actual adhesive application process and improving manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent optimizes parameters such as adhesive layer thickness, curing temperature, and bonding pressure to achieve strong bonds without requiring high manufacturing precision. By carefully controlling these parameters, the bond strength is maximized while the manufacturing process remains simple and precise.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively suppresses flexure oscillations and improves the positioning accuracy of the magnetic head by increasing the bond strength and stabilizing the manufacturing process.

Implementation Method 1

an adhesive applied between a base plate and a flexure to bond the flexure to the base plate

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS8873202B2Head gimbal assembly in which flexure swing is suppressed and disk device including the same

Publication Date: 2014.10.28 KK TOSHIBA

AI summary

A head gimbal assembly includes a base plate, a load beam, a first end of which is supported by the base plate, a magnetic head supported at a second end of the load beam, a flexure including a plurality of wirings electrically connected to the magnetic head, the flexure extending from a surface of the base plate to an edge of the base plate, an adhesive applied in a space formed between the surface of the base plate and a surface of the flexure facing the surface of the base plate to bond the flexure to the base plate and to the edge of the base plate.