Hierarchical Compute Memory Architecture for AI Workloads

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Solution Overview

Problem

Existing compute-in-memory (CiM) architectures face inefficiencies due to the lack of integration with different levels of CiM and compute-outside-of-memory (CoM) technologies, leading to memory bottlenecks and increased power consumption, particularly in machine learning workloads.

Innovation Solution

A hierarchical compute and memory architecture that integrates CiM, compute-near-memory (CnM), and CoM elements, allowing for unified weight storage and computation at leaf node compute units, reducing memory bandwidth issues and enhancing processing efficiency by leveraging both analog and digital technologies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If compute-in-memory (CiM) architecture is used, then computation speed is improved, but memory bandwidth requirements increase

Engineering Contradiction:
Improvecomputation speedVSAvoidmemory bandwidth requirements
Core Design Contradiction:
SpeedVSQuantity of substance

Solution Approach 1:

The patent divides the memory hierarchy into multiple levels: compute-in-memory (CiM) elements at the lowest level, compute-near-memory (CnM) elements at an intermediate level, and compute-outside-of-memory (CoM) elements at the highest level. This segmentation allows data to be processed at the most appropriate level, reducing the need for high memory bandwidth while maintaining computation speed.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a hierarchical dimension to the memory architecture, organizing compute and memory resources across multiple levels (CiM, CnM, CoM) rather than a single flat level. This dimensional organization enables efficient data processing at each level, reducing overall memory bandwidth requirements while maintaining high computation speed through localized processing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Speed

If compute-in-memory (CiM) architecture is used, then computation speed is improved, but power consumption increases

Engineering Contradiction:
Improvecomputation speedVSAvoidpower consumption
Core Design Contradiction:
SpeedVSUse of energy by moving object

Solution Approach 1:

The patent segments the compute resources across three hierarchical levels (CiM, CnM, CoM), allowing computations to be distributed according to their complexity and data availability. This segmentation enables energy-efficient processing by performing simple operations at the CiM level where data already resides, reducing the energy cost of data movement while maintaining high computation speed for critical operations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by optimizing each hierarchical level for specific computation types and data characteristics. CiM elements handle operations requiring highest speed with minimal data movement, CnM elements handle intermediate operations, and CoM elements handle complex computations. This localized optimization reduces overall power consumption while maintaining high computation speed where needed.

Inventive Principle:
Principle #3Local quality

3Quantity of substance

If integrated hierarchical architecture (CiM, CnM, CoM) is implemented, then memory bandwidth requirements are reduced, but device complexity increases

Engineering Contradiction:
Improvememory bandwidth requirementsVSAvoidarchitecture complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent segments the memory and compute resources into three distinct hierarchical levels (CiM, CnM, CoM), each with specific functions. This segmentation reduces memory bandwidth requirements by enabling local processing at each level, while the modular nature of the segmentation makes the complexity manageable through clear functional boundaries and standardized interfaces between levels.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240045723A1Hierarchical compute and storage architecture for artificial intelligence application
Publication Date: 2024.02.08 INTEL CORP
  • US20240045723A1 patent drawing
  • US20240045723A1 patent drawing
  • US20240045723A1 patent drawing

AI summary

Systems, apparatuses and methods include technology that executes, with a compute-in-memory (CiM) element, first computations based on first data associated with a workload, and a storage of the first data, executes, with a compute-near memory (CnM) element, second computations based on second data associated with the workload and executes, with a compute-outside-of-memory (CoM) element, third computations based on third data associated with the workload. The technology further receives, with a multiplexer, processed data from a first element of the CiM element, the CnM element and the CoM element, and provides, with the multiplexer, the processed data to a second element of the CiM element, the CnM element and the CoM element.