Hierarchical Die Ejector Structure for Simpler Chip Separation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional die ejectors require multiple vertical driving units for each ejecting block, leading to high costs and complex control algorithms, making them inefficient for separating semiconductor chips from dicing tape.

Innovation Solution

A die ejector design with two vertical driving units, where one unit moves both driving blocks simultaneously, and the other moves only one block, ensuring consistent upper level during movement, reducing costs and simplifying control algorithms.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple vertical driving units are provided for each ejecting block, then the ejecting operation can be performed, but the cost increases and the control algorithm becomes complex

Engineering Contradiction:
Improveejecting operationVSAvoidcontrol algorithm
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the control of multiple ejecting blocks into a single vertical driving unit. The first vertical driving unit simultaneously moves both the first and second driving blocks, which in turn control multiple ejecting blocks. This consolidation reduces the number of independent control systems from multiple vertical driving units to just one or two, significantly simplifying the control algorithm while maintaining reliable ejecting operation across all blocks.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The first driving block is designed to perform multiple functions: it controls both the first ejecting block directly and the second driving block that controls the second ejecting block. This multi-functional design allows a single vertical driving unit to manage multiple ejecting blocks, reducing the overall system complexity and control burden while maintaining full ejecting capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple vertical driving units are provided for each ejecting block, then the ejecting operation can be performed, but the cost increases

Engineering Contradiction:
Improveejecting operationVSAvoidcost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent consolidates multiple vertical driving units into one or two units that control multiple driving blocks and ejecting blocks through a hierarchical structure. This merging reduces the total number of expensive vertical driving units required, directly lowering manufacturing costs while maintaining reliable ejecting operation through the coordinated control of the reduced number of units.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If a single vertical driving unit moves multiple driving blocks, then costs and control complexity are reduced, but the upper level consistency during movement must be maintained

Engineering Contradiction:
Improvecontrol algorithmVSAvoidupper level consistency
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent segments the driving system into hierarchical levels: the first vertical driving unit controls the first and second driving blocks, while the second vertical driving unit controls only the second driving block. This segmentation allows independent control of each driving block's vertical position, enabling precise maintenance of upper level consistency during movement while keeping the overall control system simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements feedback mechanisms through guide portions and sliding portions that constrain the second driving block to move only along the vertical direction defined by the first driving block. This mechanical feedback ensures that the upper levels of all ejecting blocks remain consistent during movement, automatically correcting any positional deviations without requiring complex control algorithms.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS20250273490A1Die ejector
Publication Date: 2025.08.28 FLC
  • US20250273490A1 patent drawing
  • US20250273490A1 patent drawing
  • US20250273490A1 patent drawing

AI summary

The present disclosure relates to a die ejector, which separates a pickup-target chip from dicing tape, and more specifically, to a die ejector including a plurality of vertical driving units in a subordinate structure. The die ejector may include an ejector module including an ejecting block that comes into contact with dicing tape, a first driving block configured to perform, through upward or downward movement thereof, first upward or downward movement of the ejecting block, a second driving block configured to perform, through upward or downward movement thereof, second upward or downward movement of the ejecting block, a first vertical driving unit configured to move the first and second driving blocks upward or downward simultaneously, and a second vertical driving unit configured to move only the second driving block upward or downward.