Hierarchical Structure Manufacturing Apparatus for Flexible Substrates
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Solution Overview
Problem
Conventional flexible product manufacturing technologies using organic materials face limitations due to poor performance compared to silicon or compound semiconductors, and silicon/compound semiconductors are brittle, making them unsuitable for flexible applications.
Innovation Solution
An apparatus for manufacturing a hierarchical structure by layering high-performance silicon or compound semiconductor micro units on a flexible substrate using a dummy substrate and adhering processes such as plasma treatment, self-assembled monolayers, and temperature control to achieve strong adhesion and flexible integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If silicon or compound semiconductor is used to improve performance, then electron transfer speed is improved, but brittleness increases making flexible application difficult
Solution Approach 1:
The semiconductor structure is divided into multiple layers including a flexible substrate layer and a semiconductor layer, allowing the brittle semiconductor material to be segmented and mounted on a flexible base, thus reducing overall brittleness while maintaining high electron transfer speed
Solution Approach 2:
A composite structure is formed by combining flexible substrate materials (such as polymers or metals) with brittle semiconductor materials, creating a hybrid structure that exhibits both flexibility from the substrate and high electron transfer speed from the semiconductor layer
2Strength
If organic materials are used for flexible products, then flexibility is achieved, but performance deteriorates due to slow electron transfer speed
Solution Approach 1:
The invention creates a composite structure combining organic flexible substrate materials with inorganic semiconductor materials, thereby achieving both the flexibility of organic materials and the high electron transfer speed of inorganic semiconductors in a single integrated structure
3Productivity
If roll-to-roll printing is used for mass production, then productivity is improved, but manufacturing precision deteriorates due to size limits
Solution Approach 1:
The manufacturing process is segmented into separate steps: first fabricating precise semiconductor elements using high-precision semiconductor manufacturing techniques, then transferring them to flexible substrates using roll-to-roll printing. This allows precision element fabrication to be decoupled from the mass production transfer process
Solution Approach 2:
Semiconductor elements are pre-fabricated on rigid substrates with high precision before being transferred to flexible substrates through roll-to-roll printing, allowing precise manufacturing to be performed in advance and then replicated at high speed through the transfer process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the performance of flexible products by 10 to 100 times that of conventional organic materials, improves productivity, and enables mass production of large-scaled elements and structures beyond the size limits of conventional roll-to-roll printing.
Implementation Method 1
the adhering process means is a surface treating device using plasma
Implementation Method 2
the adhering process means is a surface treating device using self-assembled monolayers (SAMs)
Implementation Method 3
the adhering process means is an irradiation device irradiating laser, ultraviolet rays, or ion beams
Implementation Method 4
the adhering process means is formed as a temperature control device that controls the temperature of the target substrate to be lower than the temperature of the dummy substrate
Implementation Method 5
a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate
Implementation Method 6
a transfer stage flat-transferring the dummy substrate by supporting the same
Data Source
AI summary
The present invention relates to an apparatus for massive manufacturing a hierarchical structure that can hierarchically form high performance micro units one a flexible substrate. For this purpose, an apparatus for manufacturing a hierarchical structure according to the present invention is provided to layer micro units provided on a dummy substrate that is made of a hard material on a target substrate that is made of a flexible material by releasing the micro units from the dummy substrate. The apparatus includes: a transfer stage flat-transferring the dummy substrate by supporting the same and a main roller rolling the target substrate by winding the same as the transfer stage proceeds and layering the micro unit of the dummy substrate on the target substrate.