Hierarchical Sub-Shape Fitting for Lithography Overlay Precision

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Solution Overview

Problem

Current metrology techniques face limitations in reducing the size of metrology targets and improving measurement accuracy and sensitivity, particularly in overlay measurement, where existing methods struggle to capture diffraction orders effectively and separate target signals from surroundings, leading to less reliable results.

Innovation Solution

The method involves fitting sub-shapes of different orders hierarchically to describe a shape, using a computer system to optimize the fit of sub-shapes of the first and second order, and co-optimizing them to improve the accuracy of parameter determination, such as critical dimension and overlay error, by covering the area or volume of the shape while minimizing errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional metrology techniques are used to measure overlay and critical dimension, then measurement can be performed, but measurement precision and sensitivity are insufficient, especially for small target sizes

Engineering Contradiction:
Improveoverlay measurement precisionVSAvoidmetrology target size
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent segments the metrology target into multiple diffraction order regions (first order, second order, etc.) that can be independently analyzed. Each diffraction order provides separate measurement information, allowing the target to be divided into functional zones that improve measurement precision without requiring a larger overall target area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from analyzing only the zeroth diffraction order to utilizing multiple diffraction orders (first, second, and higher orders) in the angular spectrum domain. This dimensional expansion in the diffraction space enables enhanced measurement sensitivity and precision while maintaining compact target dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conventional diffraction analysis is used, then target measurement is possible, but target signals cannot be effectively separated from surroundings

Engineering Contradiction:
Improvesignal separation reliabilityVSAvoidtarget signal isolation
Core Design Contradiction:
ReliabilityVSLoss of information

Solution Approach 1:

The patent segments the angular spectrum into distinct diffraction order regions, where each order is spatially separated and can be independently analyzed. This segmentation allows the target signal to be isolated from background and surrounding signals, improving reliability by preventing signal contamination.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces diffraction order separation as an intermediary mechanism that acts as a spatial filter between the target signal and surrounding background. By utilizing the angular dispersion of diffraction, the method creates natural separation zones that prevent signal mixing and improve measurement reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If single diffraction order analysis is used, then measurement is simpler, but measurement sensitivity and accuracy are reduced

Engineering Contradiction:
Improvecritical dimension measurement accuracyVSAvoiddiffraction analysis complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extends the analysis from a single diffraction order to multiple diffraction orders in the angular spectrum. This dimensional expansion provides additional measurement data points and enhances sensitivity, as each diffraction order contributes independent information about the target structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines measurements from multiple diffraction orders (zeroth, first, second, and higher orders) to achieve enhanced measurement precision. By merging the information from different diffraction regions, the method achieves superior accuracy while managing complexity through systematic data integration.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances measurement sensitivity and accuracy, allowing for better decoupling of parameters and more precise determination of features, even at smaller target sizes, improving the reliability of overlay and critical dimension measurements.

Implementation Method 1

a scatterometer in which a beam of radiation is directed onto a target on a substrate and properties of the scattered and/or reflected (or more generally redirected) beam are measured

Methodology Applied
Scientific EffectScattering: Scattering

Implementation Method 2

properties of the scattered and/or reflected (or more generally redirected) beam are measured

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 3

A spectroscopic scatterometer directs a broadband radiation beam onto the substrate and measures the spectrum (intensity as a function of wavelength) of the radiation redirected into a particular narrow angular range

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 4

An angularly resolved scatterometer uses a monochromatic radiation beam and measures the intensity of the redirected radiation as a function of angle

Methodology Applied
Scientific EffectDiffraction: Diffraction

Data Source

PatentUS10379446B2Lithography system, method and computer program product for hierarchical representation of two-dimensional or three-dimensional shapes
Publication Date: 2019.08.13 ASML NETHERLANDS BV
  • US10379446B2 patent drawing
  • US10379446B2 patent drawing
  • US10379446B2 patent drawing

AI summary

This disclosure includes a variety of methods of describing a shape in a hierarchical manner, and uses of such a hierarchical description. In particular, this disclosure includes a method comprising: fitting one or more sub-shapes of a first order against a shape; determining an error of the fitting; and fitting one or more sub-shapes of a second order against the error.