Hierarchical Wafer Inspection via Dual-Module Mapping

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Solution Overview

Problem

In the wafer production process, the high cost and time consumption associated with inspection and metrology processes are exacerbated by the need for accurate and reliable evaluation of defects, particularly buried cracks in silicon dies, which current technologies struggle to address efficiently.

Innovation Solution

A system comprising a first evaluation module for fast, coarse inspection and a second, more reliable evaluation module for detailed analysis, where a mapping between their results identifies sites requiring further analysis by the second module, optimizing the evaluation process to reduce unnecessary high-resolution measurements and enhance accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single reliable evaluation module is used to evaluate all sites, then measurement precision and reliability are improved, but device complexity and production time increase

Engineering Contradiction:
Improveevaluation reliabilityVSAvoidproduction yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The evaluation system is segmented into two distinct modules: a first evaluation module for rapid inspection of all sites and a second evaluation module for detailed analysis of selected sites. This segmentation allows the system to maintain high reliability for critical evaluations while improving overall productivity by avoiding unnecessary detailed analyses on all sites.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different evaluation modules are applied to different sites based on their characteristics. The first evaluation module is applied to all sites for initial screening, while the second, more reliable evaluation module is applied only to selected sites that require it. This local quality approach optimizes both reliability and productivity by matching evaluation depth to site requirements.

Inventive Principle:
Principle #3Local quality

2Measurement precision

If all sites are evaluated by the more reliable second evaluation module, then measurement precision is improved, but loss of time and production cost increase

Engineering Contradiction:
Improveevaluation precisionVSAvoidinspection time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

Instead of applying the second evaluation module to all sites (excessive action), the system applies it only to selected sites that require it (partial action). The first evaluation module performs a preliminary screening that identifies which sites need the more time-consuming second evaluation, thereby reducing overall inspection time while maintaining precision where needed.

Inventive Principle:
Principle #16Partial or excessive action

Solution Approach 2:

The first evaluation module performs a preliminary evaluation of all sites before the second evaluation module is activated. This preliminary action filters out sites that can be confidently evaluated by the first module alone, preventing time waste on sites that don't require the more precise second evaluation.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a mapping between first and second evaluation results is established, then reliability of estimation is improved, but device complexity increases

Engineering Contradiction:
Improvestate estimation reliabilityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A mapping relationship acts as an intermediary between the first and second evaluation modules. This mapping allows the system to translate and correlate results from the first evaluation module with the second evaluation module, enabling reliable state estimation for sites evaluated by the first module without requiring direct complex integration of both modules' data processing capabilities.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS10732128B2Hierarchical wafer inspection
Publication Date: 2020.08.04 CAMTEK LTD
  • US10732128B2 patent drawing
  • US10732128B2 patent drawing
  • US10732128B2 patent drawing

AI summary

There may be provided a method for evaluating an object, that may include evaluating a region of the object by a first evaluation module to provide first evaluation results that are related to multiple sites of the region; finding, using a mapping between values of first evaluation results and values of second evaluation results, (a) a first site of the multiple sites that does not require an evaluation by a second evaluation module, and (b) a second site of the multiple sites that requires an evaluation by the second evaluation module; wherein the second evaluation module is more reliable than the first evaluation module; evaluating the second site by the second evaluation module to provide second evaluation results of the second sites; estimating, based on first evaluation results of the first site and on the mapping, a state of the first site; and providing an evaluation of the region based on the state of the first site, and on the second evaluation result of the second site.