High Airflow Storage Array with Bypass Channels
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Solution Overview
Problem
Storage modules in servers restrict airflow, leading to cooling challenges and decreased thermal performance due to high air impedance at the server's inlet, which hinders the efficient dissipation of heat generated by these modules.
Innovation Solution
The design incorporates high airflow storage device arrays with airflow bypass channels and redirecting mechanisms, such as openings in barrier walls and plenum areas, to facilitate airflow around storage modules, using fans to draw air from the front and sides and dissipate heat generated by the modules, while maintaining a minimal frontal cross-sectional area for easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If storage modules are installed in server inlet areas, then storage capacity is improved, but airflow restriction increases and thermal performance deteriorates
Solution Approach 1:
The storage device array is segmented into multiple device bays separated by divider walls, with airflow bypass channels integrated between adjacent divider walls. This segmentation allows storage modules to be distributed across multiple bays while maintaining dedicated airflow paths that bypass the storage modules, thus preserving storage capacity while reducing airflow restriction.
Solution Approach 2:
Airflow bypass channels act as intermediary pathways that allow cooling air to flow around storage modules without being blocked by them. These channels are defined by space between adjacent barrier walls and provide a low-impedance route for airflow, effectively mediating between the storage modules and the main airflow path to prevent thermal deterioration.
2Volume of moving object
If storage modules are clustered closely together, then space utilization is improved, but air impedance increases and cooling efficiency decreases
Solution Approach 1:
The design incorporates airflow bypass channels that extend in multiple dimensions around the storage modules. By utilizing vertical and lateral spaces between device bays and around storage modules, the system creates three-dimensional airflow paths that bypass clustered storage modules, maintaining high space utilization while preventing air impedance from increasing cooling energy loss.
3Shape
If barrier walls are added to define device bays, then structural organization is improved, but airflow blockage increases
Solution Approach 1:
The barrier walls are designed with localized openings and are positioned to define device bays while maintaining airflow bypass channels in specific regions. Rather than creating complete blockages, the walls provide structural organization in certain areas while allowing airflow to pass through designated channels, thus achieving local structural reinforcement without overall airflow blockage.
4Ease of operation
If storage modules are placed at server inlet, then ease of access is improved, but thermal performance deteriorates due to restricted airflow
Solution Approach 1:
The system pre-cools air before it reaches the storage modules by directing airflow through bypass channels that avoid the inlet area blockages. Fans are positioned to draw air through optimized paths that bypass storage modules at the inlet, providing preliminary cooling action before air contacts the storage devices, thus maintaining ease of access while improving thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances airflow within server systems, improving thermal performance by effectively redirecting airflow around storage modules and dissipating heat, thus addressing the cooling challenges posed by storage devices in servers.
Implementation Method 1
Fans may be provided in the high airflow storage device arrays to draw air that flows from the front and/or from the sides of the barrier walls from the storage modules, away from the storage modules
Implementation Method 2
openings are provided in the barrier walls so that heat generated from storage modules can be drawn into the flow channels defined by the adjacent barrier walls and be drawn away from the storage modules
Data Source
AI summary
An electronic assembly for handling a storage module is provided. The electronic assembly includes an open frame structure having a front frame including a front opening configured to receive air, and two side rails coupled to opposite sides of the front frame. Each side rail includes a side opening and an extended portion. The side opening is configured to direct the air received by the front opening at least partially out of the open frame structure. The extended portion extends from the side opening and away from the front frame and is configured to hold a storage module. The electronic assembly includes a lever bar coupled in proximity to the opposite sides of the front frame and having a lock position that is configured to lock the storage module onto a chassis base and a release position that is configured to release the storage module from the chassis base.