High-Aspect Ratio Electroplated Structures
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Solution Overview
Problem
Current electroplating technologies face challenges in achieving high-aspect ratio electroplated structures with tight conductor pitches, multiple layers, and precise alignment, which limits the performance and efficiency of devices such as coils and motor applications.
Innovation Solution
The development of high-aspect ratio electroplated structures through a method that includes providing a substrate with a metal base and electroplating a metal crown, using a combination of low and high current density plating techniques, and selective formation of metal crowns to achieve aspect ratios greater than 1:1, enabling tighter conductor pitches and multiple layers with precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electroplating processes are used, then manufacturing simplicity is maintained, but aspect ratio and conductor pitch precision deteriorate
Solution Approach 1:
The electroplating process is divided into multiple sequential stages: initial electroplating to form a base layer, followed by selective electroplating to form metal crowns on specific portions. This segmentation allows each stage to optimize for different requirements, achieving high aspect ratios while maintaining process control
Solution Approach 2:
Different plating conditions are applied to different regions of the substrate. The selective electroplating process applies high current density only to specific portions (where metal crowns are desired) while using low or zero current density on other portions, creating locally optimized structures with varying aspect ratios and metal distributions
2Productivity
If high current density plating is used throughout, then plating speed increases, but uniformity and void formation worsen
Solution Approach 1:
The patent applies different current densities to different regions: high current density is applied selectively to specific portions to achieve fast plating speed and high metal crown formation, while low or zero current density is applied to other portions to maintain uniformity and prevent voids. This local differentiation resolves the contradiction between speed and uniformity
3Manufacturing precision
If low current density plating is used throughout, then uniformity improves, but plating speed and aspect ratio achievement worsen
Solution Approach 1:
The process segments the substrate into regions requiring different plating rates. The selective electroplating stage uses high current density on specific portions to rapidly build metal crowns and achieve high aspect ratios, while using low current density on other portions to maintain uniform plating. This segmentation allows the system to achieve both high speed (where needed) and high uniformity (where needed)
Solution Approach 2:
Different current density levels are applied locally to different portions of the substrate based on desired outcomes. High current density regions achieve fast plating and high aspect ratios, while low current density regions maintain uniformity. This local quality differentiation resolves the contradiction between plating speed and uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in devices with improved electromagnetic field strength, reduced footprint, and increased performance, achieving 20% more force with 30% less power and half the thickness of current technologies, while allowing for flexible electrical characteristics and reduced layer requirements.
Implementation Method 1
electroplating a metal crown on the base to form the metal structure
Implementation Method 2
electroplating processes for manufacturing structures such as copper or copper alloy circuit structures
Data Source
AI summary
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.