High Bandwidth IO Connector with Compressible Contacts

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Solution Overview

Problem

Current input/output (IO) interfaces and connectors fail to meet the increasing bandwidth demands of future computing systems and peripheral components, as they exhibit high parasitic inductance and capacitance, limiting data rate and power efficiency.

Innovation Solution

The development of a high-bandwidth connector configuration featuring a housing with a paddle card region and compressible contacts, such as spring loaded pins or C-shaped contacts, which minimize electrical parasitic inductance and capacitance by reducing the physical distance between the circuit board and paddle card, and an asymmetric metal shell that exposes contacts for improved signaling density and reduced wear.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If current IO connector configurations are used, then device compatibility is maintained, but bandwidth and data rate are limited due to high parasitic inductance and capacitance

Engineering Contradiction:

ImprovebandwidthVSAvoidparasitic inductance and capacitance

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the physical parameters of the connector by reducing the length and optimizing the geometry of contact elements and signal paths. This minimizes parasitic inductance and capacitance, enabling higher bandwidth and data rates while maintaining compatibility with existing interfaces.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces a paddle card configuration with contacts extending in multiple dimensions, creating a three-dimensional contact arrangement. This dimensional change reduces the physical distance between signal paths and reference planes, lowering parasitic effects while increasing signaling density.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If contact distance is reduced to minimize parasitic inductance, then bandwidth improves, but contact wear increases

Engineering Contradiction:

Improvedata rateVSAvoidcontact durability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent employs spring-loaded compliant contacts that dynamically adjust their contact pressure. This dynamic mechanism ensures optimal electrical contact while distributing mechanical wear over time, maintaining both high data rates and contact durability through self-regulating force application.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent uses composite contact structures combining different materials with complementary properties - such as soft compliant materials for electrical contact and harder materials for structural support. This composite approach minimizes parasitic inductance while reducing wear through material optimization.

Inventive Principle:

Principle #40Composite materials

3Productivity

If signaling density is increased to improve bandwidth, then data rate improves, but device complexity increases

Engineering Contradiction:

Improvesignaling densityVSAvoidconnector structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the connector into modular sections with standardized contact arrays arranged in systematic patterns. This segmentation allows high signaling density to be achieved through repeated modular units rather than complex monolithic structures, reducing overall device complexity while maintaining high bandwidth capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent designs universal contact elements and housing structures that serve multiple functions - providing electrical connection, mechanical support, alignment, and wear distribution. This multi-functionality reduces the number of separate components needed, achieving high signaling density without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly enhances data rate and power efficiency by minimizing electrical parasitic inductance and capacitance, while also increasing signaling density and reducing wear on contacts, thus addressing the bandwidth limitations of existing IO interfaces.

Implementation Method 1

minimize electrical parasitic inductance and capacitance

Methodology Applied

Scientific EffectParasitic inductance:

Implementation Method 2

minimize electrical parasitic inductance and capacitance

Methodology Applied

Scientific EffectParasitic capacitance: Capacitance

Data Source

PatentEP2795730B1High bandwidth connector for internal and external IO interfaces

Publication Date: 2017.12.20 INTEL CORP

Figure 1~3
Figure 4A~4B
Figure 5~6

AI summary

Methods and systems to support input output (10) communications may include an lO connector having a housing with surfaces defining a paddle card region, and a set of compressible contacts extending vertically through the housing into the paddle card region. In addition, an 10 interconnect can include a cable portion and at least one end portion coupled. to the cable portion. The end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the circuit board. The end portion can also include an asymmetric metal shell having a configuration that encloses at least a portion of the paddle card and exposes the set of contacts.