Multi-Functional High Current Circuit Board Shielding

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Solution Overview

Problem

High current circuit boards struggle to combine the functions of conducting high currents and controlling power semiconductors effectively due to the inability to adequately shield electromagnetic and thermal fields, which affects adjacent layers and limits their functionality.

Innovation Solution

A multi-functional high current circuit board design featuring a current conduction layer with multiple strata, a control layer with power circuit breakers, and integrated shielding elements that decouple and shield the current conduction layer from the switching and control layers, allowing for reliable high current conduction and effective field shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If high current is conducted through the circuit board, then current conduction capability is improved, but electromagnetic and thermal fields affect adjacent layers causing interference

Engineering Contradiction:

Improvecurrent conduction capabilityVSAvoidelectromagnetic and thermal field interference

Core Design Contradiction:

PowerVSObject-affected harmful factors

Solution Approach 1:

A shielding layer comprising a plurality of strata is introduced as an intermediary between the current conduction layer and adjacent functional layers. This shielding layer acts as a mediator that blocks electromagnetic and thermal fields generated by high current conduction, preventing interference with control circuits and signal layers while allowing the high current function to operate independently.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The circuit board is segmented into distinct functional layers: a current conduction layer for high current, a shielding layer for field isolation, and control layers for circuit functionality. This segmentation separates the harmful high-current function from sensitive control functions, allowing each layer to perform its specific function without interfering with others.

Inventive Principle:

Principle #1Segmentation

2Object-affected harmful factors

If shielding elements are added to block fields, then field shielding capability is improved, but device complexity increases

Engineering Contradiction:

Improvefield shielding capabilityVSAvoidcircuit board structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shielding layer is designed with multi-functionality: it serves as both a field-shielding barrier and a structural component of the circuit board. By integrating the shielding function into the board's layered structure rather than adding separate shielding components, the design achieves effective field blocking without proportionally increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The shielding layer utilizes composite material properties, combining conductive materials for electromagnetic shielding with thermally conductive materials for heat dissipation. This composite approach allows a single layer to address both electromagnetic and thermal interference, reducing the need for additional separate shielding components.

Inventive Principle:

Principle #40Composite materials

3Adaptability or versatility

If multiple layers are combined for high current and control functions, then device integration is improved, but field interference between layers increases

Engineering Contradiction:

Improvedevice integrationVSAvoidinter-layer field interference

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The shielding layer acts as an intermediary barrier between the current conduction layer and control layers, enabling the integration of multiple functions in a compact multi-layer structure while preventing field interference. This mediator allows high-current and control functions to coexist in the same device without mutual interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables the simultaneous conduction of high currents and control of power semiconductors while minimizing electromagnetic and thermal interference, allowing for a compact, energy-efficient, and robust circuit board that maintains performance during high-frequency switching operations.

Implementation Method 1

the high current circuit board comprises at least one shielding element for shielding the current conduction layer from the switching layer and from the control layer

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

electrical, magnetic and/or thermal fields caused by the current flow can be reliably shielded by the at least one shielding layer

Methodology Applied

Scientific EffectThermal shielding: Thermal Insulation

Data Source

PatentUS10334718B2Multi-functional high-current circuit board

Publication Date: 2019.06.25 ZF FRIEDRICHSHAFEN AG

AI summary

A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.