High Current Circuit Board via Direct Via Switch Connection
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Solution Overview
Problem
Modern vehicles require high-current circuits that can handle increasing energy demands, but conventional printed circuit boards struggle with current-carrying capacity and heat dissipation due to non-conductive substrates and high ohmic losses.
Innovation Solution
A high-current circuit design using a conventional printed circuit board with conductive layers and vias to directly connect semiconductor switches across the board, eliminating the need for thin conductor tracks and enabling effective heat dissipation through large contact pads and heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional circuit breaker designs are used, then device complexity is reduced, but reliability deteriorates due to failure points in moving components and electronic control systems
Solution Approach 1:
The patent extracts and removes the electronic control system and moving components from the circuit breaker design. The invention uses a purely mechanical tripping mechanism where a bimetallic strip and spring system directly open the circuit without any electronic controllers, motors, or moving switches, thereby eliminating failure points associated with these components.
Solution Approach 2:
The circuit breaker employs self-service through automatic tripping mechanisms. The bimetallic strip automatically responds to overheating conditions by bending and releasing the latch mechanism, causing the circuit to open without human intervention or electronic control. The spring system automatically resets when the fault condition is removed.
2Quantity of substance
If high current carrying capacity is achieved through larger conductors, then current capacity increases, but volume and weight increase
Solution Approach 1:
The patent utilizes composite material structures in the contacts and conductive elements. The contact assemblies employ composite materials that combine high electrical conductivity with high mechanical strength, allowing the circuit breaker to handle high currents without requiring proportionally larger conductor dimensions. This enables high current capacity in a compact form factor.
3Device complexity
If thermal expansion of contacts is neglected, then device complexity is reduced, but harmful factors increase due to contact separation under load
Solution Approach 1:
The patent applies local quality by providing differential thermal expansion compensation at the contact interfaces. The contact assemblies are designed with specific material selections and geometric configurations that locally accommodate thermal expansion effects, allowing contacts to maintain proper pressure and alignment even when subjected to temperature changes during high-current operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures high current-carrying capacity and efficient heat dissipation, allowing for reliable mass production of high-current circuits suitable for motor vehicles while maintaining cost-effectiveness.
Implementation Method 1
a spring (14) positioned to apply an elastic force to the lever (12)
Implementation Method 2
a bi-metallic strip (22) positioned above the movable contact (18) and bent into a generally L-shape
Data Source
Figure 1~2
Figure 3~5b
Figure 6~7b
AI summary
The invention relates to a high current circuit with a circuit board consisting of a non-conducting substrate 2, a conductor layer 4 applied on the substrate 2 and an insulation layer 6 applied on the conductor layer, wherein contact pads 8, 10, 12, 20, 22, 24 breaking through the insulation layer 6 are arranged on either side of the circuit board and the contact pads 8, 10, 12, 20, 22, 24 are connected to one another through the substrate 2 by vias 14 and the vias 14 are arranged in the surface of the contact pads 8, 10, 12, 20, 22, 24, characterized in that at least one first of the contact pads 8 is arranged on a first side of the circuit board and a first semiconductor switch 28 on a second side of the circuit board is directly connected to at least one second of the contact pads 20, and that the semiconductor switch 28 is connected to the first contact pad 8 directly through the vias 14 and to the second contact pad 20, without further conductor tracks.