High-Density Connector Laser Metallization

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Solution Overview

Problem

Existing high-density electrical connectors face challenges in maintaining quality, robustness, and manufacturing efficiency, particularly in achieving miniaturization, functionality, and cost rationalization while maintaining a small footprint and high contact density, especially in outdoor applications.

Innovation Solution

The use of the LPKF-LDS (LPKF-Laser Diode System) technology for laser activation of plastic followed by conventional galvanic metallization to create interpenetrating parts that form a high-density connection, allowing for simple and cost-effective manufacturing of connectors with enhanced quality and reduced size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional contact manufacturing and assembly methods are used, then quality can be maintained at an average level, but it becomes impossible to guarantee a high level of quality industrially

Engineering Contradiction:

Improvecontact qualityVSAvoidindustrial manufacturability

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces traditional mechanical contact manufacturing and assembly methods with laser activation technology (LPKF-LDS) for surface metallization. This substitution enables precise control of contact properties and consistent quality across industrial production, overcoming the limitations of conventional mechanical approaches while maintaining manufacturability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the physical and chemical parameters of the plastic surface through laser activation, creating a metallizable surface layer with controlled properties. This parameter transformation allows for high-precision contact formation and consistent quality induction, resolving the contradiction between manufacturing precision and ease of manufacture.

Inventive Principle:

Principle #35Parameter changes

2Quantity of substance

If connectors are designed for indoor applications (rectangular HDMI-style), then high contact density can be achieved, but robustness to external environmental exposure deteriorates

Engineering Contradiction:

Improvecontact densityVSAvoidenvironmental robustness

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent employs composite construction by integrating metallized plastic components with protective metal housing and sealing elements. This composite approach maintains high contact density within the connector while providing robust protection against environmental factors, enabling outdoor application reliability without sacrificing contact density.

Inventive Principle:

Principle #40Composite materials

3Reliability

If connectors are encapsulated to improve robustness, then environmental protection improves, but footprint increases and tightness becomes more difficult to guarantee

Engineering Contradiction:

Improveenvironmental protectionVSAvoidconnector footprint

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent implements a nested design where sealing elements and protective structures are integrated within the existing connector geometry rather than adding external encapsulation layers. This nesting approach provides environmental protection while minimizing increases in connector footprint and maintaining tightness control.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Productivity

If stamping methods are used for manufacturing, then high-volume production capability is achieved, but substantial investment is required and applicability to low-volume industrial markets deteriorates

Engineering Contradiction:

Improveproduction volume capabilityVSAvoidmanufacturing cost-effectiveness

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent utilizes laser activation parameters that can be precisely controlled and adjusted for different production volumes. This flexibility allows the same manufacturing process to be effectively applied across a wide range of production quantities, from low-volume industrial applications to high-volume production, without requiring substantial infrastructure investment or sacrificing cost-effectiveness.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of high-quality, high-density electrical connectors that are robust, efficient to manufacture, and maintain a small footprint, addressing the limitations of traditional methods by providing simple metallization of non-planar surfaces and reducing part complexity while ensuring reliable electrical transport.

Implementation Method 1

apply in the first step of the manufacturing process of the connector according to the invention a new method of metallization of the surface by laser activation of the plastic

Methodology Applied

Scientific EffectLaser activation: Laser

Implementation Method 2

This process consists in the activation of a plastic by laser, technology known under the terminology LPKF-LDS

Methodology Applied

Scientific EffectLPKF-LDS process:

Implementation Method 3

The next step is the metallization of the parts activated by the LPKF-LDS process by conventional galvanic bath processes

Methodology Applied

Scientific EffectGalvanic metallization: Electroplating

Data Source

PatentEP2702639B1High-density connector

Publication Date: 2017.01.04 FISCHER CONNECTORS HLDG

AI summary

The invention relates to a connector which includes basic parts (1) that can be assembled and nested together, forming a high-density connector technology for hermaphroditic contacts.