High Density Connector With Stacked Signal And Ground Wafers
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Solution Overview
Problem
Existing connector designs face challenges in increasing density while minimizing space on a circuit board, as more closely arranged communication channels lead to cross-talk and ground vias interfere with ideal signal trace routing configurations, making it difficult to improve data rates and efficiently mount connectors.
Innovation Solution
A connector design featuring side-by-side signal wafers forming differential pairs with broad-side coupled configurations, where ground wafers are electrically connected to tail stubs on signal wafers, allowing for compact routing on minimal layers and reducing cross-talk through strategic placement of ground vias and conductive members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If communication channels are arranged more closely to increase density, then the number of transmission channels per unit area increases, but cross-talk between neighboring channels increases
Solution Approach 1:
Ground wafers are introduced as intermediary elements positioned between adjacent signal wafers. These ground wafers act as electromagnetic shields that block cross-talk between neighboring differential pairs while maintaining compact channel spacing. The ground terminals on these wafers provide reference potential and prevent signal interference.
Solution Approach 2:
The connector is segmented into multiple wafers (signal wafers and ground wafers) stacked in alternating layers. This segmentation allows signal channels to be closely spaced while ground wafers are interspersed between them to provide electromagnetic isolation, effectively dividing the space into isolated signal zones.
2Reliability
If ground vias are positioned to connect ground terminals, then electrical ground connection is established, but ideal signal trace routing configurations are interfered with
Solution Approach 1:
The ground connection problem is solved by transitioning from a planar routing approach to a three-dimensional stacked wafer approach. Ground terminals are positioned on the same lateral footprint as signal terminals but in different vertical layers (on ground wafers between signal wafers), allowing ground vias to be placed directly underneath without interfering with signal trace routing on the circuit board.
Solution Approach 2:
The ground wafer structure merges the ground terminal positioning with the signal terminal positioning by aligning them laterally while separating them vertically. This allows both signal and ground connections to be made at the same board location without conflicting routing requirements.
3Area of stationary object
If connector size is reduced to minimize board space, then space efficiency increases, but routing space for signal traces and ground vias becomes limited
Solution Approach 1:
The connector utilizes vertical stacking of multiple thin wafers to achieve high channel density within a minimal lateral footprint. By arranging signal and ground wafers in alternating layers, the design accommodates numerous transmission channels while maintaining a compact board-mounted profile, with ground vias positioned directly beneath signal vias to maximize space efficiency.
Data Source
AI summary
A connector can be provided that allows for improved route-out including straight-back routing. Signal and ground terminal tails can be arranged in a single row to help facilitate such functionality. A conductive member can connect ground tails to ground terminals. Consequentially, a connector with two vertically stacked card slots can be provided that allows for straight back routing of the signal traces in four layers while still providing a compact connector design.