High-Density Molybdenum PVD Target for Uniform Film Deposition
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Solution Overview
Problem
There is a need for a sputtering target apparatus with an improved life span and uniform composition to ensure high-quality thin films in physical vapor deposition processes.
Innovation Solution
A molybdenum PVD target material with a density of 99% or greater, combined with a backer plate, is used to enhance target life and reduce plasma dropouts during deposition operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If conventional density target material is used, then manufacturing cost is reduced, but target life span is shortened and plasma dropouts increase
Solution Approach 1:
The patent applies parameter changes by increasing the density of the target material from conventional levels to 99% or greater. This parameter modification directly extends target life span and reduces plasma dropouts during deposition operations, while the backer plate configuration maintains manufacturing feasibility
2Duration of action of stationary object
If higher density target material is used, then target life is extended, but voltage requirements and manufacturing complexity increase
Solution Approach 1:
The patent employs composite materials by combining high-density target material (99% or greater) with a backer plate structure. This composite configuration extends target life while the backer plate helps manage voltage requirements and provides structural support, balancing the energy consumption trade-off
3Manufacturing precision
If conventional target material composition is used, then manufacturing is simpler, but film uniformity and quality are compromised
Solution Approach 1:
The patent applies parameter changes by specifying a density of 99% or greater for the target material, which directly improves film uniformity and deposition quality. The backer plate configuration maintains manufacturing simplicity by providing a straightforward structural solution that accommodates the high-density material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased density and purity of the molybdenum target material result in reduced voltage requirements, fewer plasma dropouts, and extended target life, ensuring consistent and uniform film deposition.
Implementation Method 1
In sputtering, high-energy ions bombard the target material of the target assembly, dislodging atoms from a target that are then deposited onto the substrate
Implementation Method 2
Physical Vapor Deposition (PVD) is a crucial thin-film deposition technique extensively employed in semiconductor substrate processing to create thin layers of materials with enhanced properties. PVD operates under vacuum conditions and involves the evaporation or sputtering of target materials
Data Source
AI summary
A physical vapor deposition (PVD) chamber deposits thin films on substrates by forming a high density plasma with a PVD target. More particularly, apparatus and methods are presented that improve film deposition uniformity when a target material of the PVD target includes a molybdenum PVD target material and a density of 99% or greater.