High-Density Carrier Tape with Thermal-Release Adhesive

Solution Overview

Problem

Existing carrier tapes offer a relatively low density of electrical components due to the need for mechanical detachment, which can damage the components and limit the number that can be arranged per unit length.

Innovation Solution

The carrier tape uses an adhesive that releases electrical components through heating or irradiation with light, such as visible, infrared, or ultraviolet light, allowing for increased component density without mechanical damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mechanical detachment using a pen is used to release electrical components, then the attachment can be broken, but the electrical component may be damaged and the density of components per unit length is limited

Engineering Contradiction:

Improvecomponent integrityVSAvoidcomponent density

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The patent replaces the mechanical detachment system (pen pushing against the carrier tape) with a thermal release system. The adhesive is configured to release the electrical component when heated to a specific temperature, eliminating the need for mechanical force that could damage the component. This substitution allows multiple components to be arranged closely together without risk of damage from mechanical manipulation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the release mechanism from mechanical force to thermal energy by controlling the temperature parameter. The adhesive has a specific melting point or glass transition temperature below which it maintains strong bonding. When the carrier tape is heated to this temperature, the adhesive changes its physical state and releases the component. This parameter change enables safe, damage-free component removal and allows higher component density.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If mechanical detachment is used to release electrical components, then the attachment can be broken, but the risk of damaging the electrical component increases

Engineering Contradiction:

Improvecomponent integrityVSAvoiddamage risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical detachment system (pen pushing against the carrier tape) with a thermal release system. The adhesive is configured to release the electrical component when heated to a specific temperature, eliminating the need for mechanical force that could damage the component. This substitution allows multiple components to be arranged closely together without risk of damage from mechanical manipulation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes phase transition of the adhesive material to achieve release. The adhesive is designed with a specific melting point or glass transition temperature. When the carrier tape is heated to this temperature, the adhesive undergoes phase change from a bonded state to a released state, allowing the component to be removed without mechanical force. This phase transition mechanism eliminates the harmful mechanical contact that could damage the component.

Inventive Principle:

Principle #36Phase transitions

3Quantity of substance

If adhesive releases components through heating or irradiation, then component density can be increased, but energy or light sources are required for release

Engineering Contradiction:

Improvecomponent densityVSAvoidenergy consumption

Core Design Contradiction:

Quantity of substanceVSUse of energy by moving object

Solution Approach 1:

The patent utilizes phase transition of the adhesive material to achieve release. The adhesive is designed with a specific melting point or glass transition temperature. When the carrier tape is heated to this temperature, the adhesive undergoes phase change from a bonded state to a released state, allowing the component to be removed without mechanical force. This phase transition mechanism eliminates the harmful mechanical contact that could damage the component.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent changes the release mechanism from mechanical force to thermal energy by controlling the temperature parameter. The adhesive has a specific melting point or glass transition temperature below which it maintains strong bonding. When the carrier tape is heated to this temperature, the adhesive changes its physical state and releases the component. This parameter change enables safe, damage-free component removal and allows higher component density.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables higher component density by allowing multiple components to be arranged closely together, reducing the risk of damage and enhancing the efficiency of component placement.

Implementation Method 1

the adhesive is configured to substantially release the attachment of the electrical component as a result of heating the adhesive

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light

Methodology Applied

Scientific EffectLight irradiation: Light

Data Source

PatentUS12457727B2High density carrier tape

Publication Date: 2025.10.28 NEXPERIA BV

AI summary

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.