High Dielectric Antenna Substrate with Embedded Capacitors

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Solution Overview

Problem

Conventional antenna designs face challenges in miniaturization and cost reduction due to the external placement of discrete capacitors, which increases assembly and material costs, and limits flexibility in multi-band or broadband applications.

Innovation Solution

A high dielectric antenna substrate is developed using a composite structure with layers of varying dielectric constants, where a high dielectric material is integrated to reduce antenna size and embed capacitors within the substrate, allowing for flexible design and reduced material costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If discrete capacitors are externally disposed for circuit matching, then circuit matching is achieved, but assembly cost and material cost increase

Engineering Contradiction:
Improvecircuit matchingVSAvoidassembly cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the discrete capacitor component with the antenna substrate by embedding capacitive structures directly into the substrate layers. The capacitor is formed using conductive patterns on dielectric layers that are integrated during substrate manufacturing, eliminating the need for separate discrete capacitor components and reducing assembly costs.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The antenna substrate is designed to serve multiple functions: it provides the antenna radiation structure, circuit matching through embedded capacitors, and mechanical support. The same substrate layers that form the antenna also contain the capacitive elements, making the substrate a multi-functional component that replaces both antenna and discrete capacitor.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If discrete capacitors are externally disposed for circuit matching, then circuit matching is achieved, but device complexity increases

Engineering Contradiction:
Improvecircuit matchingVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The capacitor structure is merged with the antenna substrate, reducing the number of separate components. The conductive patterns forming the capacitor are created using the same layer structure as the antenna, integrating multiple functions into a single device structure.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If conventional substrate materials are used, then manufacturing is simple, but antenna size is large

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidantenna size
Core Design Contradiction:
Ease of manufactureVSVolume of moving object

Solution Approach 1:

The patent changes the dielectric constant parameter of the substrate material to achieve miniaturization. By using high dielectric constant materials, the patent reduces the physical dimensions of the antenna while maintaining its electrical performance characteristics.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite dielectric structures with multiple layers having different dielectric constants. This composite approach allows optimization of both electrical performance and physical size, achieving miniaturization while maintaining manufacturability.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a smaller antenna size, reduced material and assembly costs, and increased flexibility in design, while also shortening microwave radiation wavelength for miniaturization.

Implementation Method 1

a high dielectric material is integrated to reduce antenna size and embed capacitors within the substrate, allowing for flexible design and reduced material costs

Methodology Applied
Scientific EffectDielectric: Dielectric

Implementation Method 2

shortening microwave radiation wavelength for miniaturization

Methodology Applied
Scientific EffectMicrowave radiation wavelength shortening: Microwave Radiation

Implementation Method 3

embed capacitors within the substrate

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS7446711B2High dielectric antenna substrate and antenna thereof
Publication Date: 2008.11.04 IND TECH RES INST
  • US7446711B2 patent drawing
  • US7446711B2 patent drawing
  • US7446711B2 patent drawing

AI summary

A high dielectric antenna substrate and antenna thereof are provided. The substrate includes a first dielectric layer having a first dielectric constant, and a second dielectric layer having a second dielectric constant. The second dielectric layer is formed on one surface of the first dielectric layer. The second dielectric constant is lower than the first dielectric constant. Furthermore, a first metal layer and a second metal layer are optionally formed on the same surface or two surfaces of the first dielectric layer to compose a capacitor.