High Dielectric Antenna Substrate with Embedded Capacitors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional antenna designs face challenges in miniaturization and cost reduction due to the external placement of discrete capacitors, which increases assembly and material costs, and limits flexibility in multi-band or broadband applications.
Innovation Solution
A high dielectric antenna substrate is developed using a composite structure with layers of varying dielectric constants, where a high dielectric material is integrated to reduce antenna size and embed capacitors within the substrate, allowing for flexible design and reduced material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete capacitors are externally disposed for circuit matching, then circuit matching is achieved, but assembly cost and material cost increase
Solution Approach 1:
The patent merges the discrete capacitor component with the antenna substrate by embedding capacitive structures directly into the substrate layers. The capacitor is formed using conductive patterns on dielectric layers that are integrated during substrate manufacturing, eliminating the need for separate discrete capacitor components and reducing assembly costs.
Solution Approach 2:
The antenna substrate is designed to serve multiple functions: it provides the antenna radiation structure, circuit matching through embedded capacitors, and mechanical support. The same substrate layers that form the antenna also contain the capacitive elements, making the substrate a multi-functional component that replaces both antenna and discrete capacitor.
2Reliability
If discrete capacitors are externally disposed for circuit matching, then circuit matching is achieved, but device complexity increases
Solution Approach 1:
The capacitor structure is merged with the antenna substrate, reducing the number of separate components. The conductive patterns forming the capacitor are created using the same layer structure as the antenna, integrating multiple functions into a single device structure.
3Ease of manufacture
If conventional substrate materials are used, then manufacturing is simple, but antenna size is large
Solution Approach 1:
The patent changes the dielectric constant parameter of the substrate material to achieve miniaturization. By using high dielectric constant materials, the patent reduces the physical dimensions of the antenna while maintaining its electrical performance characteristics.
Solution Approach 2:
The patent employs composite dielectric structures with multiple layers having different dielectric constants. This composite approach allows optimization of both electrical performance and physical size, achieving miniaturization while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a smaller antenna size, reduced material and assembly costs, and increased flexibility in design, while also shortening microwave radiation wavelength for miniaturization.
Implementation Method 1
a high dielectric material is integrated to reduce antenna size and embed capacitors within the substrate, allowing for flexible design and reduced material costs
Implementation Method 2
shortening microwave radiation wavelength for miniaturization
Implementation Method 3
embed capacitors within the substrate
Data Source
AI summary
A high dielectric antenna substrate and antenna thereof are provided. The substrate includes a first dielectric layer having a first dielectric constant, and a second dielectric layer having a second dielectric constant. The second dielectric layer is formed on one surface of the first dielectric layer. The second dielectric constant is lower than the first dielectric constant. Furthermore, a first metal layer and a second metal layer are optionally formed on the same surface or two surfaces of the first dielectric layer to compose a capacitor.


