High-Entropy Alloy Substrate for Wavelength-Converting Element
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Solution Overview
Problem
Conventional aluminum substrates in projection apparatuses using laser diodes have low temperature resistance, leading to deformation and the generation of pores during high-temperature curing, which affects the conversion efficiency and reflectivity of the phosphor wheel.
Innovation Solution
A wavelength-converting element with a high-entropy alloying substrate, featuring at least five major alloying elements and one minor element, where the mixed entropy is greater than 3 J/K·mol, allowing for direct coating and high-temperature curing of the diffusion reflection and wavelength-converting layers without demolding, enhancing mechanical strength, temperature resistance, and reflectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional aluminum substrates are used for the phosphor wheel, then the manufacturing cost is low and ease of manufacture is good, but the temperature resistance is poor leading to deformation and pore generation during high-temperature curing
Solution Approach 1:
The patent changes the material parameters of the substrate from conventional aluminum to high-entropy alloy by adjusting compositional parameters (at least five major elements with specific atomic percentages summing to 35-100 at%). This parameter change enables the substrate to withstand high-temperature curing (above 800°C) without deformation or pore generation, while still maintaining manufacturability through established alloy preparation techniques
Solution Approach 2:
The patent employs composite material design by creating a high-entropy alloy substrate composed of multiple principal elements (Ni, Co, Cu, Al, Ti, etc.) in specific proportions. This composite structure combines the advantages of different metals to achieve both high temperature resistance (maintaining structural integrity at curing temperatures) and manufacturing feasibility through conventional metallurgical processes
2Strength
If high-temperature curing is performed to improve the bonding strength of the wavelength-converting layer, then the mechanical strength is improved, but pores are generated in the process affecting conversion efficiency
Solution Approach 1:
The patent changes the substrate material parameters to high-entropy alloy composition, which fundamentally alters the curing process outcomes. The unique atomic structure and high configurational entropy of the alloy enable dense packing and uniform microstructure formation during high-temperature curing, achieving strong bonding without pore generation that would compromise conversion efficiency
Solution Approach 2:
The patent converts the potentially harmful effect of high-temperature curing (which typically causes pore formation in conventional substrates) into a beneficial process. The high-entropy alloy substrate transforms the high-temperature environment into an opportunity for achieving both strong layer bonding and pore-free dense structure, simultaneously improving mechanical strength and optical conversion efficiency
3Ease of operation
If multiple demolding and attachment steps are performed to assemble the phosphor wheel components, then the assembly flexibility is improved, but the reflectivity and conversion efficiency are reduced due to additional interfaces and potential defects
Solution Approach 1:
The patent merges multiple separate components (substrate, wavelength-converting layer, and diffusion reflection layer) into a single integrated structure through direct formation on the high-entropy alloy substrate. This consolidation eliminates intermediate demolding and attachment steps, removing additional interfaces that would reduce reflectivity and conversion efficiency, while the high-entropy alloy substrate provides the necessary thermal and mechanical stability for this integrated approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves mechanical strength, temperature resistance, and reflectivity of the wavelength-converting element, reducing pores and enhancing conversion efficiency, thereby minimizing brightness degradation in projection images.
Implementation Method 1
A material of the alloying substrate includes at least five major alloying elements and at least one minor alloying element. The alloying substrate has mixed entropy, which is greater than 3 J/K·mol
Implementation Method 2
The diffusion reflection layer is disposed between the alloying substrate and the wavelength-converting layer
Implementation Method 3
The wavelength-converting layer is configured to convert the excitation beam into a converted beam
Data Source
AI summary
A wavelength-converting element includes an alloying substrate, a wavelength-converting layer and a diffusion reflection layer. A material of the alloying substrate includes at least five major alloying elements and at least one minor alloying element. The at least five major alloying elements are selected from a group consisting of Ni, Ti, V, Cr, Mn, Fe, Co, Al, Cu, Ta, Nb, Zr, Mg and Pt group elements. An atomic percentage of each of the major alloying elements is between 5 at % and 35 at %. The alloying substrate has mixed entropy, which is greater than 3 J/K·mol. The wavelength-converting layer is disposed above the alloying substrate. The diffusion reflection layer is disposed between the alloying substrate and the wavelength-converting layer. The invention further provides a projection apparatus using the wavelength-converting element and a manufacturing method of the wavelength-converting element. The wavelength-converting element of the invention can improve mechanical properties, temperature resistance and reflectivity.