High Frequency Amplifier Impedance Matching Using Passive SMD Components
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Solution Overview
Problem
Conventional high frequency amplifiers designed for multiple frequency bands require an active device and control circuit to adjust matching conditions, increasing parts count and reducing operating efficiency.
Innovation Solution
A high frequency amplifier with a package substrate, amplifying active device, and SMD components shunt-connected to a transmission line, allowing impedance adjustment without an active device or control circuit by varying connections to ground on a mounting board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an active device and control circuit are added to adjust matching conditions for multiple frequency bands, then the amplifier can operate in multiple frequency bands, but the parts count increases and operating efficiency decreases
Solution Approach 1:
The invention extracts and removes the active device and control circuit from the amplifier structure. Instead of using these active components to adjust matching conditions, the patent uses passive SMD components (capacitors and inductors) with different connection configurations to achieve frequency band adaptation, thereby reducing parts count and improving operating efficiency
Solution Approach 2:
The SMD components are designed to serve multiple functions: they provide both matching conditions adjustment and frequency band selection through different connection configurations. The same passive components can be connected in series or parallel to ground to achieve different impedance values suitable for different frequency bands, eliminating the need for separate control circuits
2Adaptability or versatility
If an active device and control circuit are added to adjust matching conditions for multiple frequency bands, then the amplifier can operate in multiple frequency bands, but the operating efficiency decreases due to additional power consumption
Solution Approach 1:
The invention extracts and removes the active device and control circuit from the amplifier structure. Instead of using these active components to adjust matching conditions, the patent uses passive SMD components (capacitors and inductors) with different connection configurations to achieve frequency band adaptation, thereby reducing parts count and improving operating efficiency
Solution Approach 2:
The amplifier uses passive SMD components that automatically provide the required matching conditions for different frequency bands through their inherent electrical properties. These passive components do not require external power supply or control signals, allowing the amplifier to adapt to different frequency bands without additional power consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables operation in multiple frequency bands with reduced parts count and improved efficiency by eliminating the need for an active device and control circuit, simplifying manufacturing and operation.
Implementation Method 1
chip capacitors 21 and 51 are shunt-connected to the transmission line for matching purposes
Implementation Method 2
A chip inductor and a diode 52 are connected to the chip capacitor 51
Implementation Method 3
the diode 52 can be turned on and off by selectively controlling the application of the voltage from a terminal 53. That is, the chip capacitor 51 can be electrically connected to and disconnected from ground by turning on and off the diode 52
Data Source
AI summary
A high frequency amplifier includes a package substrate, an amplifying active device disposed on a top surface of the package substrate, a transmission line connected to the amplifying active device and transmitting a high frequency signal, a surface mounted device (SMD) component shunt-connected at a first end to the transmission line, a SMD component terminal connected to a second end of the SMD component and partially exposed at a back surface of the package substrate, and an external terminal partially exposed at the back surface of the package substrate and connected to a first end of the transmission line, opposite a second end of the transmission line that is connected to the amplifying active device.