High Frequency Circuit Board Thermal Damage Prevention
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Solution Overview
Problem
High frequency circuit boards using thermoplastic resins for dielectric layers face thermal damage issues due to high hot-pressing temperatures, which compromise the integrity of electronic components.
Innovation Solution
A method involving the sequential formation of a thermoplastic resin dielectric layer followed by embedding an electronic component in a thermosetting resin layer, where the thermoplastic resin is hot-pressed before the component is mounted, and the thermosetting resin is applied afterwards, ensuring the component is not exposed to high temperatures during hot-pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermoplastic resin is used as dielectric and hot-pressed at high temperature (350°C or higher), then high frequency characteristics are improved, but electronic component is damaged due to excessive heat
Solution Approach 1:
The dielectric layer is segmented into two distinct layers: a first dielectric layer portion made from thermoplastic resin (providing high frequency characteristics) and a second dielectric layer portion made from thermosetting resin (providing thermal protection). This segmentation allows each layer to fulfill its specific function without compromising the other.
Solution Approach 2:
The thermoplastic resin is hot-pressed to form the first dielectric layer portion before the electronic component is mounted on the substrate. This preliminary action ensures that the high frequency circuit pattern is already covered with the thermoplastic resin layer before the component is exposed to high temperatures, preventing thermal damage.
Solution Approach 3:
The first dielectric layer portion made from thermoplastic resin acts as an intermediary between the high frequency circuit pattern and the electronic component, providing excellent high frequency characteristics while the second dielectric layer portion made from thermosetting resin provides thermal protection during the hot-pressing process.
2Volume of moving object
If electronic component is embedded in dielectric layer formed by hot-pressing thermoplastic resin, then board size is reduced, but electronic component cannot withstand the heat and is damaged
Solution Approach 1:
The dielectric layer is divided into two functional segments: the first dielectric layer portion (thermoplastic resin) that provides high frequency characteristics and size reduction, and the second dielectric layer portion (thermosetting resin) that provides thermal protection during hot-pressing.
Solution Approach 2:
The thermoplastic resin is hot-pressed to form the first dielectric layer portion before the electronic component is mounted, achieving size reduction through embedding preparation without exposing the component to damaging temperatures.
3Object-affected harmful factors
If thermosetting resin is used as dielectric and hot-pressed at low temperature (220°C), then electronic component is protected from thermal damage, but high frequency characteristics are not improved
Solution Approach 1:
The dielectric layer is segmented into two specialized layers: the first dielectric layer portion made from thermoplastic resin specifically for providing high frequency characteristics, and the second dielectric layer portion made from thermosetting resin specifically for providing thermal protection during hot-pressing.
Solution Approach 2:
Different regions of the dielectric structure have different material properties: the first dielectric layer portion uses thermoplastic resin with excellent high frequency characteristics, while the second dielectric layer portion uses thermosetting resin with good thermal stability and low cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents thermal damage to electronic components while enhancing high frequency characteristics and reducing board size by interposing thermoplastic and thermosetting resin layers between the ground conductor and the high frequency circuit pattern.
Implementation Method 1
performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked in this order on the one surface of the provisional substrate, to form a first dielectric layer portion covering the high frequency circuit pattern, from the thermoplastic resin
Implementation Method 2
performing hot-press in a state where a thermosetting resin and a ground conductor are stacked in this order at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion in which the electronic component in the cavity is embedded, from the thermosetting resin
Data Source
AI summary
A method for producing a high frequency circuit board includes forming an antenna pattern on an upper surface of the provisional substrate. The method includes performing hot-press in a state where a thermoplastic resin and a provisional conductor are stacked on the upper surface of the provisional substrate, to form a first dielectric layer portion covering the antenna pattern. The method includes removing the provisional conductor and shaving the first dielectric layer portion to form a cavity to house an electronic component. The method includes mounting the electronic component on the antenna pattern in the cavity. The method includes performing hot-press in a state where a thermosetting resin and a ground conductor are stacked at an opening side of the cavity in the first dielectric layer portion, to form a second dielectric layer portion to embed the electronic component in the cavity. The method includes removing the provisional substrate.