High-Frequency Laminate with Modified Resin for Laser Processing
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Solution Overview
Problem
Existing laminates and films used in circuit boards face challenges in achieving both excellent level difference followability and laser processing suitability, particularly at high frequencies.
Innovation Solution
A laminate comprising a layer A and a layer B with a conductive pattern, where the laminate has a dielectric loss tangent of 0.01 or less at 28 GHz and a mass residual rate difference of 40% or more between 440°C and 900°C, incorporating a resin with specific functional groups and a thermoplastic elastomer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a resin composition is designed to achieve excellent level difference followability, then the film can conform well to circuit board surfaces, but laser processing suitability deteriorates due to poor UV laser workability
Solution Approach 1:
The patent modifies the chemical structure of the binder resin by introducing specific functional groups (carboxyl, hydroxyl, or amine groups) to change the material's interaction with UV laser. This parameter change enables the resin to maintain both good level difference followability and improved UV laser workability, resolving the contradiction between shape conformability and manufacturability.
Solution Approach 2:
The patent creates a composite resin composition combining the modified binder resin with inorganic fillers (silica and/or aluminum hydroxide) having specific particle sizes (1 μm or less). This composite structure achieves both excellent level difference followability through the binder resin's properties and good laser processing suitability through the filler's characteristics, resolving the technical contradiction.
2Temperature
If polyimide is used as the insulating material, then heat resistance is improved, but dielectric loss in high frequency band increases
Solution Approach 1:
The patent employs a composite material system consisting of modified binder resin and fine inorganic fillers (silica and aluminum hydroxide with particle sizes of 1 μm or less). This composite structure achieves low dielectric loss tangent (0.005 or less at 10 GHz) while maintaining adequate heat resistance, thereby resolving the contradiction between heat resistance and dielectric loss in high frequency applications.
3Ease of manufacture
If the inorganic filler particle size is reduced to improve resin workability, then the resin composition becomes easier to process, but the dielectric loss tangent increases
Solution Approach 1:
The patent specifies precise parameters for the inorganic fillers: particle size of 1 μm or less, and controlled content ratios of silica (20-70 parts by mass) and aluminum hydroxide (5-80 parts by mass) per 100 parts by mass of binder resin. These parameter specifications optimize both resin workability and dielectric properties, achieving low dielectric loss tangent while maintaining good processability.
Solution Approach 2:
The patent creates a optimized composite material system where fine inorganic fillers (silica and aluminum hydroxide) are combined with modified binder resin in specific proportions. This composite structure achieves both improved resin workability through fine particle dispersion and low dielectric loss tangent, resolving the contradiction between manufacturability and energy loss.
Data Source
AI summary
Provided are: a laminate including a layer A, a layer B on at least one surface of the layer A, and a conductive pattern in contact with at least a part of the layer B, in which the laminate has a dielectric loss tangent of 0.01 or less at 28 GHz, and a value obtained by subtracting a mass residual rate at 900° C. from a mass residual rate at 440° C. of the layer B is 40% by mass or more; a film including a layer A and a layer B on at least one surface of the layer A, in which the film has a dielectric loss tangent of 0.01 or less at 28 GHz, an elastic modulus of the layer B is 0.5 MPa or less at 160° C., and the layer B contains a thermosetting resin; a thermosetting film; and a method of manufacturing a wiring board using the film and the thermosetting film.