High-Frequency Measurement Line Structure for Mode Conversion Loss Reduction

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Solution Overview

Problem

High-frequency measurement accuracy is compromised due to mode conversion loss and impedance mismatch when using ground-signal-ground probes with grounded co-planar waveguide transmission lines, especially at higher frequencies, leading to excessive reflection and loss.

Innovation Solution

A high-frequency measurement line structure featuring a multi-layer circuit board with a transition section and high-frequency probe pads, including a slot in the second metal layer to facilitate mode conversion between the multi-conductor transmission line and the probe, optimizing the slot's width and shape to reduce radiation loss and signal coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If grounded co-planar waveguide transmission line is used with ground-signal-ground probe, then the structure is compatible with multi-layer board integration and substrate thickness requirements, but mode conversion loss and impedance mismatch occur leading to measurement inaccuracy

Engineering Contradiction:
Improvecompatibility with multi-layer board integrationVSAvoidmeasurement accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent introduces a transition section as an intermediary structure between the ground-signal-ground probe and the grounded co-planar waveguide transmission line. This transition section includes a signal line with specific impedance transformation and ground plane configurations that gradually convert the electromagnetic mode from the probe to the transmission line, reducing mode conversion loss and impedance mismatch while maintaining compatibility with multi-layer board integration.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs parameter changes in the transition section, including varying the signal line width, adjusting the ground plane dimensions, and modifying the impedance values along the transition path. These parameter transformations enable smooth impedance matching between the probe and transmission line, reducing reflections and improving measurement accuracy while adapting to multi-layer board constraints.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If ground-signal-ground probe is used to probe grounded co-planar waveguide, then the probe structure is simple and commonly available, but excessive reflection and loss occur at high frequencies reducing measurement accuracy

Engineering Contradiction:
Improveprobe structure simplicityVSAvoidsignal reflection and loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The transition section serves as an intermediary that bridges the simple ground-signal-ground probe and the grounded co-planar waveguide. It includes impedance transformation structures and ground plane designs that reduce signal reflection and energy loss at high frequencies, allowing the use of simple probes without sacrificing measurement quality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent addresses high-frequency performance by introducing dimensional changes in the transition section, such as varying the thickness of dielectric layers, adjusting the height of signal lines, and modifying the three-dimensional arrangement of ground planes. These dimensional adjustments reduce parasitic effects and improve high-frequency signal integrity while maintaining probe simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11300587B1High-frequency measurement line structure
Publication Date: 2022.04.12 WANSHIH ELECTRONIC CO LTD
  • US11300587B1 patent drawing
  • US11300587B1 patent drawing
  • US11300587B1 patent drawing

AI summary

A high-frequency measurement line structure includes a circuit board structure and a multi-conductor transmission line section, a high-frequency measurement probe pad section and a transition section which are formed by the circuit board structure, wherein the transition section is arranged between the multi-conductor transmission line section and the high-frequency measurement probe pad section to be connected to the multi-conductor transmission line section and the high-frequency measurement probe pad section. The high-frequency measurement probe pad section includes a group of high-frequency measurement probe pads arranged on a first metal layer of the circuit board structure to touch a high-frequency probe to transmit a high-frequency signal. A second metal layer of the circuit board structure defines a slot arranged in accordance with the high-frequency measurement probe pad section and the transition section to help a mode conversion between the high-frequency probe and the multi-conductor transmission line section.