High Frequency Module Symmetrical Diplexer Layout
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Solution Overview
Problem
Existing high frequency modules for wireless LANs face challenges in reducing size while maintaining signal isolation and efficiency, particularly due to electromagnetic coupling between transmission and reception circuits, which degrades as the module is miniaturized, and existing designs do not effectively address the positional relationship between circuits and terminals, leading to increased noise and loss.
Innovation Solution
A high frequency module with a layered substrate design featuring separate regions for diplexers and terminals, symmetrically arranged to improve isolation, and a switch circuit connecting diplexers to antennas, along with a conductor portion for electromagnetic separation, reduces transmission line length and prevents interference, enhancing signal processing in multiple frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the module size is reduced, then the compactness is improved, but the electromagnetic coupling between transmission and reception circuits increases, degrading signal isolation
Solution Approach 1:
The module is divided into separate transmission circuit region and reception circuit region within the layered substrate. This spatial segmentation prevents electromagnetic coupling between transmission and reception circuits while maintaining a compact overall module size, thus resolving the contradiction between miniaturization and signal isolation.
Solution Approach 2:
Different regions of the layered substrate are assigned different functional qualities: the transmission circuit region contains transmission terminals and transmission circuits, while the reception circuit region contains reception terminals and reception circuits. This local differentiation ensures proper signal isolation without requiring a larger module size.
2Loss of energy
If the transmission line length is reduced, then the loss and noise are decreased, but the layout complexity increases
Solution Approach 1:
The patent utilizes the vertical dimension of the layered substrate to reduce transmission line lengths. By placing circuits and terminals in different layers and using through-substrate connections, the patent achieves short transmission paths without increasing lateral layout complexity, thus reducing signal loss and noise.
Solution Approach 2:
The transmission terminals and reception terminals are pre-positioned at specific locations on the layered substrate before circuit integration. This preliminary arrangement optimizes the transmission line paths from the outset, minimizing length and potential sources of noise and loss while maintaining layout simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves improved signal isolation, reduced noise and loss, and a smaller form factor by optimizing the layout of diplexers and terminals within the layered substrate, enabling efficient processing of transmission and reception signals across multiple frequency bands.
Implementation Method 1
a first diplexer connected to the first and second reception signal terminals and the switch circuit and separating the reception signal in the first frequency band and the reception signal in the second frequency band from each other
Implementation Method 2
a second diplexer connected to the first and second transmission signal terminals and the switch circuit and separating the transmission signal in the first frequency band and the transmission signal in the second frequency band from each other
Implementation Method 3
a layered substrate including dielectric layers and conductor layers alternately stacked and integrating the foregoing components
Data Source
AI summary
A high frequency module comprises: a switch circuit connected to first and second antenna terminals; a first diplexer connected to first and second reception signal terminals and the switch circuit; a second diplexer connected to first and second transmission signal terminals and the switch circuit; and a layered substrate for integrating these components. The layered substrate includes a first region and a second region that are divided from each other by an imaginary plane that passes through the center of the bottom surface of the layered substrate and that intersects the bottom surface at a right angle. The first diplexer is located in the first region while the second diplexer is located in the second region. The locations of the first antenna terminal and the first and second reception signal terminals and the locations of the second antenna terminal and the first and second transmission signal terminals are symmetric with respect to the imaginary plane.