High-frequency Module Directional Coupler Interference Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency modules with directional couplers integrated into multilayer substrates face issues of RF signal leakage and interference due to electromagnetic coupling with other circuit elements, and manufacturing variations lead to unstable directional coupler characteristics, making adjustments difficult.
Innovation Solution
A high-frequency module design where the directional coupler is defined by internal wiring electrodes and a component with a wiring electrode mounted on land electrodes outside the multilayer substrate, allowing for easy adjustment of characteristics by selecting components with different coupling characteristics, and optimizing electrode shapes and orientations to control electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the directional coupler is formed using internal wiring electrodes within the multilayer substrate, then the module integration is improved, but electromagnetic coupling with other circuit elements causes RF signal leakage and interference
Solution Approach 1:
The directional coupler is divided into two segments: internal wiring electrodes formed within the multilayer substrate and external wiring electrodes formed on the substrate surface. This segmentation allows the internal electrodes to provide integration while the external electrodes enable controlled electromagnetic coupling with minimal interference to other circuit elements.
Solution Approach 2:
The electromagnetic coupling function is extracted from the internal wiring electrodes and transferred to the external wiring electrodes. By taking out the coupling function to the substrate surface, the internal electrodes no longer cause electromagnetic coupling with other circuit elements, eliminating RF signal leakage while maintaining integration benefits.
2Reliability
If the directional coupler characteristics are adjusted after manufacturing, then the characteristics can be optimized, but the adjustment difficulty increases due to manufacturing variations
Solution Approach 1:
The external wiring electrodes are designed with adjustable geometric parameters (length, width, spacing) that allow the directional coupler characteristics to be dynamically adjusted after manufacturing. This dynamic adjustability compensates for manufacturing variations and optimizes performance without increasing complexity.
3Volume of moving object
If the component size is reduced, then the module size is minimized, but the electromagnetic coupling between wiring electrodes becomes less reliable
Solution Approach 1:
The electromagnetic coupling is enhanced by using the substrate material with specific dielectric properties as a composite structure between the internal and external wiring electrodes. The substrate acts as a coupling medium that maintains reliable electromagnetic interaction between the electrodes even when the overall module size is reduced.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces interference with other high-frequency circuit elements, enables easy adjustment of directional coupler characteristics, and minimizes module size by reliable electromagnetic coupling and reduced surface area, while preventing parasitic capacitance and maintaining design values.
Implementation Method 1
the internal wiring electrode and the wiring electrode electromagnetically coupling with each other to define a directional coupler
Data Source
AI summary
An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.