High-Frequency Module Directional Coupler Isolation via 3D Inductor Integration
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Solution Overview
Problem
Existing high-frequency modules with directional couplers face challenges in achieving good isolation characteristics while being compact in size, as integrating these components results in compromised performance.
Innovation Solution
A high-frequency module design that includes a substrate with a directional coupler featuring a main line, sub line, and an impedance adjustment portion electrically connected to a second inductor, which enhances isolation characteristics by increasing mutual inductance between inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the directional coupler and other circuit elements are arranged close to each other or integrated into one chip, then the module size is reduced, but the isolation characteristics of the directional coupler deteriorate
Solution Approach 1:
The patent introduces a via-hole to connect the sub-line to a lower layer, transitioning from a planar two-dimensional layout to a three-dimensional structure. This vertical dimension allows the directional coupler to maintain good isolation characteristics while being integrated on a compact chip, as the via-hole provides an additional spatial dimension for signal routing that reduces interference between adjacent elements.
Solution Approach 2:
The patent embeds the via-hole connection within the multi-layer substrate structure, nesting the impedance adjustment mechanism inside the chip layers. The sub-line connects to a lower layer through the via-hole, creating a nested configuration where the impedance adjustment portion is integrated within the chip's internal structure rather than occupying additional external space.
2Reliability
If an adjustment element (inductor) is provided in the directional coupler to improve isolation characteristics, then the isolation characteristics improve, but the directional coupler size increases
Solution Approach 1:
The patent combines the impedance adjustment function with the existing sub-line structure of the directional coupler. The via-hole connection integrates the sub-line to a lower layer, merging the impedance adjustment mechanism into the directional coupler's existing architecture rather than adding separate adjustment elements, thus improving isolation characteristics without significantly increasing size.
Solution Approach 2:
By using a via-hole to connect to a lower layer, the patent utilizes the vertical dimension within the chip to provide impedance adjustment. This three-dimensional approach allows the directional coupler to achieve good isolation characteristics without expanding its planar footprint, as the adjustment mechanism is implemented in the depth dimension rather than the horizontal plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves isolation characteristics of the directional coupler while maintaining a compact size, enabling efficient communication across multiple communication bands.
Implementation Method 1
The substrate includes an inductor. The impedance adjustment portion is electrically connected to the inductor of the substrate
Implementation Method 2
The sub line is electromagnetically coupled to the main line
Data Source
AI summary
Isolation characteristics of a directional coupler are improved. A high-frequency module (1) includes a substrate (2) and a directional coupler (5) provided on the substrate (2). The directional coupler (5) includes a main line (51), a sub line (52), and an impedance adjustment portion (7). The sub line (52) is electromagnetically coupled to the main line (51). The impedance adjustment portion (7) is provided in the sub line (52), and adjusts impedance of the directional coupler (5). The impedance adjustment portion (7) is electrically connected to an inductor of the substrate (2).