High-Frequency Module Through-Hole IC Layout for Smaller Footprint
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Solution Overview
Problem
High-frequency modules face challenges in reducing size in the plane direction due to the arrangement of IC chips on a substrate, leading to increased size and material costs.
Innovation Solution
A high-frequency module design featuring a substrate with a through-hole that houses a second electronic component, connected to first and third electronic components via connection members, allowing for reduced substrate thickness and omission of bonding wires, thereby minimizing plane size while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IC chips are arranged side by side on the same plane of the substrate, then electrical connectivity between components is achieved, but the module size in the plane direction increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of IC chips to a three-dimensional configuration by placing one IC chip inside a through-hole of the substrate. This vertical stacking approach allows electrical connectivity to be maintained through connection members passing through the substrate, while significantly reducing the footprint area occupied by the components in the plane direction.
Solution Approach 2:
The patent embeds one IC chip (the second IC chip) inside a through-hole of the substrate, creating a nested structure where the IC chip is contained within the substrate volume. This nesting approach allows the second IC chip to be electrically connected to the first IC chip through connection members, achieving component integration without increasing the module's planar dimensions.
2Area of stationary object
If substrate thickness is reduced to minimize module size, then plane size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent applies different thermal management strategies to different regions of the module. The substrate is designed with through-holes that extend through its thickness, creating localized thermal pathways. Heat generated by IC chips can be conducted through the connection members and substrate structure to external heat sinks, allowing thin substrate design while maintaining adequate heat dissipation through optimized thermal conduction paths.
Data Source
AI summary
A high-frequency module includes a substrate having a first main surface and a second main surface facing each other and a through-hole that extends through the substrate from the first main surface to the second main surface, a first electronic component, and a second electronic component, and the second electronic component is disposed inside the through-hole of the substrate, the first electronic component is disposed so as to extend over the first main surface of the substrate and the second electronic component, the first electronic component is connected to the first main surface of the substrate with a first connection member interposed therebetween, the second electronic component is connected to the first electronic component with a second connection member interposed therebetween, and a first direct current signal is supplied to the second electronic component through the first connection member, the first electronic component, and the second connection member.