High-Frequency Module Ground Shielding for EMI Reduction
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Solution Overview
Problem
High-frequency modules face challenges in minimizing the adverse effects of radio waves radiated from antennas on integrated components, leading to fluctuations in performance and characteristics.
Innovation Solution
A high-frequency module design featuring a first substrate with a ground layer connected to a wiring layer and a second substrate with an antenna device, where the substrates are connected by conductive members to the ground potential, reducing radio wave propagation and electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna and high-frequency device are integrated in a compact module, then the size of communication equipment is reduced, but radio waves from the antenna cause fluctuations in the characteristics of the high-frequency circuit
Solution Approach 1:
The module is divided into two separate substrates: a first substrate for the high-frequency device and a second substrate for the antenna. This segmentation physically separates the radio wave source from the sensitive circuit while maintaining compact integration through vertical stacking, thus reducing electromagnetic interference while preserving miniaturization benefits.
Solution Approach 2:
A ground conductor layer is introduced as an intermediary between the antenna and the high-frequency device. This ground layer acts as a shield that blocks radio waves from reaching the circuit, preventing characteristic fluctuations while allowing the antenna and device to remain in close proximity for compact design.
2Object-affected harmful factors
If the ground conductor is disposed above the high-frequency circuit to shield it, then some protection is provided, but radio waves are partially transmitted around the ground conductor and still affect the circuit
Solution Approach 1:
The shielding approach is extended from a single planar ground conductor to a three-dimensional configuration where the ground conductor is disposed on both the first substrate (above the circuit) and the second substrate (below the antenna), and extends through via holes connecting both substrates. This multi-dimensional ground structure provides comprehensive electromagnetic shielding that blocks radio waves from reaching the high-frequency device, preventing characteristic fluctuations while maintaining compact integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the impact of radio waves on the high-frequency circuit, enhancing reception and transmission performance while maintaining compactness and stability.
Implementation Method 1
a ground layer on a first substrate, connected to a wiring layer and to a ground potential... an antenna device on a second substrate... a conductive connecting member connected to the ground potential and connecting the first substrate and the second substrate
Data Source
AI summary
In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.