High-Frequency Module Ground Shielding Gap for Signal Integrity
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Solution Overview
Problem
High-frequency modules suffer from unintended signal paths due to contact between ground and shielding conductor films, leading to deterioration in circuit characteristics such as spurious and isolation characteristics.
Innovation Solution
A high-frequency module configuration using a multilayer board with a ground conductor layer and shielding conductor film, where the ground conductor layer is not in contact with the shielding conductor film in the portion closest to both circuits, preventing unintended signal paths and adjusting impedance to maintain circuit integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the ground conductor layer is in contact with the shielding conductor film, then high-frequency noise suppression is improved, but unintended signal paths are formed causing deterioration in circuit characteristics
Solution Approach 1:
The patent applies local quality by making the contact between the ground conductor layer and shielding conductor film position-dependent. Contact is provided at portions远离 (away from) the first and second circuits, while deliberately avoiding contact at portions closest to the circuits. This localized differentiation resolves the contradiction by providing noise suppression where needed while preventing unintended signal paths near sensitive circuits.
Solution Approach 2:
The patent segments the contact relationship between the ground conductor layer and shielding conductor film into multiple discrete contact portions rather than continuous contact. By dividing the shielding structure into separate contact zones that are strategically positioned away from circuits, the patent prevents formation of unintended signal paths while maintaining overall shielding effectiveness for noise suppression.
2Object-affected harmful factors
If continuous contact between ground conductor layer and shielding conductor film is provided, then shielding effectiveness is improved, but impedance control deteriorates due to unintended signal paths
Solution Approach 1:
The patent implements local quality by differentiating contact zones: areas远离 from circuits provide continuous contact for shielding effectiveness, while areas closest to circuits maintain no contact for impedance control. This localized approach allows simultaneous achievement of both shielding effectiveness and precise impedance control without unintended signal paths.
Solution Approach 2:
The patent introduces an intermediary spatial relationship (no-contact zone) between the ground conductor layer and shielding conductor film at critical locations near circuits. This intermediary approach prevents direct electrical connection that would create unintended signal paths, thereby maintaining controlled impedance while still providing shielding through contact at non-critical portions.
Data Source
AI summary
A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.