High-Frequency Module Heat-Dissipating Layer Design
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Solution Overview
Problem
High-frequency modules with inorganic fillers in insulating layers exhibit excellent thermal conductivity but low physical impact resistance, leading to peeling of electronic components from the substrate during heat dissipation.
Innovation Solution
A high-frequency module design featuring a substrate with a first electronic component, a second electronic component, an insulating layer covering part of the first electronic component's side surface and the second component's side and top surfaces, and a heat-dissipating layer covering the first component's top surface and part of its side surface, made of a material with higher thermal conductivity than the insulating layer, to enhance heat dissipation and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If an inorganic filler is added to an insulating layer to improve thermal conductibility, then heat dissipation is improved, but the insulating layer becomes hard and has low resistance to physical impact, causing peeling from the substrate
Solution Approach 1:
The patent divides the protective coating into two distinct layers: an insulating layer for electrical isolation and a separate heat-dissipating layer for thermal management. This segmentation allows each layer to be optimized for its specific function without compromising the other, preventing peeling by eliminating the conflicting material properties in a single layer.
Solution Approach 2:
The patent employs a composite structure with an insulating layer containing inorganic fillers for thermal conductibility and a separate heat-dissipating layer with high thermal conductivity material. This composite approach allows the system to achieve both good thermal dissipation and peeling resistance by combining materials with complementary properties in distinct layers.
2Temperature
If a heat-dissipating layer with high thermal conductivity is applied over the insulating layer, then heat dissipation is improved, but the structural complexity increases
Solution Approach 1:
The heat-dissipating layer serves multiple functions simultaneously: it provides thermal management by conducting heat away from electronic components, offers mechanical protection to the underlying insulating layer, and can contribute to electrical isolation. This multi-functionality justifies the additional layer by delivering multiple benefits from a single structural addition.
Solution Approach 2:
The patent applies the heat-dissipating layer specifically where thermal management is most critical - directly over heat-generating electronic components and high-density wiring areas. This localized application of enhanced thermal conductivity material optimizes heat dissipation efficiency while minimizing unnecessary structural complexity in regions where it is less critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses peeling of electronic components from the substrate and improves heat dissipation efficiency while providing noise shielding and improved isolation characteristics.
Implementation Method 1
the heat that is generated from the electronic components and wiring layers is conducted to the heat sink from the insulating layer and is dissipated
Implementation Method 2
Since the heat-dissipating layer is made of a metal, it is possible to shield the high-frequency module from noise
Data Source
AI summary
A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15).