High-Frequency Module Signal Routing via Heat Sink
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Solution Overview
Problem
In high throughput optoelectronic circuits, thick cores in substrates lead to long conductive paths that distort high-frequency signals and limit the maximal frequency supported, preventing efficient electrical coupling between line cards and integrated circuits.
Innovation Solution
A high-frequency module design featuring a substrate with a heat sink and coupling module, where conductors pass through the heat sink and substrate without reaching the core's majority depth, enabling high-frequency signal transmission exceeding 100 gigabits per second, and incorporating heat sink fins for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the core thickness is increased to one millimeter, then the substrate provides sufficient structural support, but the conductive paths become long and distort high frequency signals
Solution Approach 1:
The conductive path is segmented into two parts: second conductors that travel through the thick substrate core to provide mechanical support, and first conductors that travel through the heat sink (a separate component) to maintain signal integrity. This segmentation allows the substrate to be thick for strength while the signal path avoids the problematic long conductive path through the core.
Solution Approach 2:
The heat sink serves as an intermediary component that provides an alternative conduction path for high-frequency signals. Instead of signals traveling through the entire thickness of the substrate core, they are routed through the heat sink, which acts as a mediator between the die and the external environment, thereby reducing signal distortion.
2Strength
If the core thickness is increased to one millimeter, then the substrate provides sufficient structural support, but the capacitance increases and limits the maximal frequency
Solution Approach 1:
The conductive path is segmented such that the high-frequency signal portion travels through the heat sink rather than through the entire substrate core. The second conductors provide the structural support through the thick core, while the first conductors in the heat sink provide the low-capacitance path needed for high-frequency signals above 100 GHz.
Solution Approach 2:
The heat sink acts as an intermediary that provides a low-capacitance conduction path for high-frequency signals. By routing signals through this intermediary component rather than directly through the thick substrate core, the effective capacitance in the signal path is reduced, enabling support for maximal frequencies above 100 gigabits per second.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively supports high-frequency signals above 100 gigabits per second by minimizing signal distortion and capacitance, while the heat sink efficiently dissipates heat generated by the high-frequency die.
Implementation Method 1
a heat sink and coupling module that includes a heat sink and multiple first conductors that pass through the heat sink
Implementation Method 2
multiple heat sink fins that may be spaced apart from each other
Data Source
AI summary
A method and a high-frequency module that includes (a) a high frequency die that includes multiple die pads, (b) a substrate that comprises a first buildup layer, a second buildup layer and a core that is positioned between the first buildup layer and a second buildup layer, (c) a heat sink and coupling module that comprises a heat sink and multiple first conductors that pass through the heat sink and extend outside the heat sink; (d) a line card that comprises multiple line card pads that are coupled to external ends of the multiple first conductors; (e) coupling elements that are coupled to internal end of the multiple first conductors; and (f) multiple second conductors that pass through the substrate without reaching a majority of a depth of the core, and couple the multiple die pads to the coupling elements. The high frequency it not lower than fifty gigabits per second.